Polyester film polyimide film electroplating metal is a film product made from polyester as raw material through a series of chemical processing

Polyester film, polyimide film, electroplating metal

Polyester Film (PET) is a type of film product made from polyester as raw material and processed through a series of chemical processes. The polyester film has good mechanical properties and thermal stability, good electrical conductivity and thermal conductivity, and excellent anti-aging performance. But in a normal state, The surface of PET film is easily adsorbed with various metal salt solutions and ion solutions, which affects its surface conductivity and electrical insulation, and is difficult to perform surface treatment. Therefore, coating a metal layer on the surface of polyester film is the most effective method to solve this problem. With the rapid development of the electronics industry, many new electronic components have emerged, which usually require good oxidation resistance, corrosion resistance, and radiation resistance. Copper (tin) and other metal layers on the surface of PET can effectively improve its oxidation resistance, corrosion resistance, and radiation resistance. And in Copper (tin) plating on PET surfaceAfter waiting for the metal layer, it will cause an increase in the interfacial resistance of the film layer, thereby affecting the conductivity of the polyester film. Therefore, studying the influence of metals such as copper (tin) plating on the conductivity of polyester films is of great significance.

This article investigates the electroplating process of copper (tin) using two different types of polyimide (PI) films as substrates.

Polyimide (PI) is a high-performance polymer material known as the "plastic king". It has excellent comprehensive performance and is mainly used in fields such as microelectronics, optoelectronic materials, aerospace, and defense industry.

Due to the adsorption of various metal ions and organic impurities on the surface of PI film, metal oxides or metal salts are formed on the surface of PI film, thereby reducing the conductivity of the film. To improve its conductivity, a metal coating can be applied to the surface of the PI film to solve this problem.

The general method is to electroplate metals such as copper (tin) to improve the surface conductivity of PI film.

This article focuses on the diffusion mechanism of copper tin plating process on the surface of PI film, and provides reliable reference for industrial production by analyzing various influencing factors in the electroplating process.

1. Plating solution formula: (1) Plating solution A: (2) Plating solution B: (3) Plating solution C: (4) Plating solution D: (5) Plating temperature: (10~60) ℃

2. Process conditions

Treat at 3.500 ℃ for 30 minutes to improve the adhesion and corrosion resistance of the coating.

In the electroplating process, a cyclic scanning electroplating instrument is used to perform electroplating according to different control conditions of the plating system. Experiments are conducted for 2-3 cycles and the average value is taken.

5. Ultrasonic cleaning technology is used in the electroplating process to remove surface pollutants and impurities such as dust, in order to improve the quality of the coating.

6. Temperature control: 130~150 ℃; Mixing speed: 50-100r/min; Current density: 10~20A/dm2; Electroplating time: 30-60 minutes; The post-treatment temperature is 60 ℃.

At present, we have developed three different types of polyimide electroplating processes that can be used for different purposes and combined with other metal electroplating processes to meet customer needs. Specifically, as follows:

1. Single layer film electroplating technology: electroplating copper (tin) on ordinary polyimide film;

2. Thin film surface treatment technology: surface treatment of polyimide film to obtain good conductivity and mechanical properties;

3. Coating application technology: By chemically plating copper (tin) on polyimide film to increase its conductivity.

This experiment uses the method of chemical plating The surface of the PI film is coated with copper (tin)The process parameters affecting the copper tin electroplating effect of polyester film were optimized, and the problem of increased surface resistance of the film layer caused by the introduction of conductive liquid was solved by adjusting the composition of the copper plating solution. The research results indicate that as the concentration of copper source increases, the migration rate of copper ions also increases; As the concentration of dimethylformamide in the copper plating solution increases, the migration rate of copper ions decreases; As the concentration of polyamic acid in the copper plating solution increases, the migration rate of copper ions also increases; When the concentration of dimethylformamide in the copper plating solution is 2%, the surface resistance of the polyimide film after copper plating is the smallest. Meanwhile, the PI film prepared by this method appears blue, and the color change of the polyimide film after copper plating is not significant. Therefore, the PI film prepared by this method is a blue conductive thin film and can effectively improve the surface resistance of the conductive film layer, thereby enhancing the performance of electronic components.