Ultra thin phosphor green rolled copper foil with nickel platingIt is a widely used electronic component processing technology, mainly used for manufacturing ultra-thin copper foils and nickel plated metal layers. The following is the technical principle and process flow of nickel plating on ultra-thin phosphor green rolled copper foil:
● Raw material preparation: The required raw materials include phosphor green, rolling mill, nickel plating solution, etc.
● Preparation solution: The required solutions include acidic or alkaline nickel plating solutions, activated nickel plating solutions, etc.
Process flow: Firstly, the copper foil needs to be placed in the printing equipment for printing, and then the phosphor green needs to be rolled in the printing equipment to form the surface layer of the copper foil. Subsequently, it is necessary to activate nickel plating on the surface layer to ensure its conductivity and reliability.
Nickel plating process: Activated copper foil needs to be placed in electroplating equipment for electroplating, depositing a layer of metal on the surface. During the production process, it is necessary to pay attention to controlling parameters such as electroplating temperature and time to ensure the nickel plating effect.
Ultra-thin phosphorus greenNickel plating on rolled copper foilThe preparation process mainly includes the following steps:
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Initial preparation: Select high-purity copper foil as the substrate, perform surface cleaning and oxidation removal treatment to ensure smooth subsequent processing.
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Phosphorus green treatment: Soak the substrate in a solution containing phosphoric acid and nitric acid. After a certain period of treatment, a layer of phosphorus green compound will form on the surface of the substrate, which can improve the adhesion and corrosion resistance of the nickel plating layer.
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Rolling treatment: The phosphorus green copper foil is mechanically rolled to form an ultra-thin rolled copper foil, which can improve the surface flatness and smoothness of the copper foil for subsequent processing.
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Nickel plating treatment: Soak ultra-thin phosphor green rolled copper foil in a solution containing nickel salt, and form a uniform nickel layer on the surface of the copper foil through electrochemical reaction. This step can improve the conductivity and corrosion resistance of copper foil.
- Precision processing: The nickel plated copper foil is subjected to precision processing and testing to ensure that its quality and performance meet the requirements. Ultra thin phosphor green rolled copper foil nickel plating is widely used in the field of electronic devices, such as flexible circuit boards, LED display screens, solar cells, etc. Due to its good conductivity, corrosion resistance, and strong high-temperature resistance, it has become an important material for the preparation of these devices.
Overall, ultra-thin phosphor green
Nickel plating on rolled copper foilIt is a simple, fast, and reliable electronic component processing technology widely used in the manufacturing of electronic components and electronic products. When using ultra-thin phosphor green rolled copper foil for nickel plating, it is necessary to evaluate and consider the specific situation to ensure production quality and efficiency.
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