Study on the Compatibility of YB6016 Low Temperature Curing Silver Adhesive with Research Platinum Brand on Different Substrates

Brief introduction

In recent years, due toAdvanced Institute (Shenzhen) Technology Co., LtdThe low-temperature curing silver adhesive developed, especially the product model Yanbo brand YB6016, has received widespread attention and use. Low temperature cured silver paste is widely used in fields such as chips, semiconductors, and electronic packaging. Due to its good conductivity and relatively lower curing temperature characteristics, it is favored by engineers. However, regarding its compatibility on different substrates, our company has conducted a series of rigorous and systematic research and testing to provide more accurate product application guidelines.

2、 Overview of Characteristics

Research Platinum YB6016 Low Temperature Curing Silver AdhesiveIt is a high-performance conductive adhesive that ensures high strength, excellent heat resistance, chemical resistance, and outstanding electrical conductivity. In addition, its curing temperature is relatively low, greatly reducing production costs and equipment wear. Based on these characteristics, we designed the following compatibility research experiment.

3、 Experimental Design for Compatibility Study

We selected five commonly used substrates (ceramics, polymers, silicon wafers, metals, glass) for compatibility testing. The methods adopted include but are not limited to thermal cycling test, wet heat test, tensile strength test, etc.

4、 Experimental data and analysis

Here are our main experimental data:

1. Ceramics:
   • Tensile strength: 4.8 MPa. The higher the tensile strength, the stronger the bond between the silver adhesive and the substrate, thus demonstrating good compatibility. The tensile strength of 4.8 MPa indicates that the YB6016 brand of Yanbo is tightly bonded to the ceramic substrate.
   • Remaining deflection: 30%. The residual deflection reflects the degree of deformation of the silver paste under certain external forces. The smaller the residual deflection, the better the compatibility between the silver paste and the substrate. A residual deflection of 30% shows good compatibility between the YB6016 brand and ceramics.
   • Thermal expansion coefficient: 23 ppm/℃. The coefficient of thermal expansion refers to the expansion or contraction characteristics of materials under temperature changes. The closer the coefficient of thermal expansion between silver paste and substrate, the smaller the internal stress generated during temperature changes, and the better the compatibility,Research Platinum Brand YB6016The thermal expansion coefficient of 23 ppm/℃ with ceramics indicates good compatibility between the two under temperature changes.
2. Polymer:
   • Tensile strength: 2.1 MPa. Low tensile strength means that the bonding between silver paste and substrate is not strong enough, reflecting the relatively poor compatibility between YB6016 and polymer. The tensile strength of 2.1 MPa indicates a low degree of tightness between the two.
   • Remaining deflection: 60%. The larger residual deflection indicates that the silver paste deforms significantly when subjected to external forces on the polymer substrate, which also reflects the poor compatibility between the YB6016 brand and the polymer. The 60% residual deflection indicates that there are certain compatibility issues between the two.
   • Thermal expansion coefficient: 180 ppm/℃. The difference in thermal expansion coefficient between YB6016 and polymer is significant, and it is prone to generate large internal stresses when the temperature changes, which affects the compatibility between the two. The thermal expansion coefficient of 180 ppm/℃ indicates poor compatibility between the two.
3. Silicon wafer:
   • Tensile strength: 3.6 MPa. The tensile strength to some extent reflects the bonding ability between silver paste and silicon wafer. The tensile strength of 3.6 MPa indicates that YB6016 from Yanbo brand has a certain bonding force with silicon wafer, demonstrating good compatibility.
   • Resonance frequency: 45%. The remaining deflection here (assuming an error in resonance frequency expression) reflects the stability of the silver paste on the silicon wafer, and 45% of the remaining deflection indicates that the YB6016 brand has good stability on the silicon wafer, thereby demonstrating good compatibility.
   • Thermal expansion coefficient: 2.5 ppm/℃. The close thermal expansion coefficient is beneficial for maintaining good compatibility under temperature changes. The thermal expansion coefficient of YB6016 and silicon wafer at 2.5 ppm/℃ indicates good compatibility between the two under temperature changes.
4. Metal:
   • Tensile strength: 5.0 MPa. A higher tensile strength means that the YB6016 from Yanbo brand is firmly bonded to the metal substrate, demonstrating good compatibility. A tensile strength of 5.0 MPa indicates a very tight bond between the two.
   • Remaining deflection: 20%. The smaller residual deflection indicates that the silver paste deforms less when subjected to external forces on the metal substrate, which also reflects the good compatibility between YB6016 and metal. A residual deflection of 20% shows good compatibility between the two.
   • Thermal expansion coefficient: 19 ppm/℃. The close thermal expansion coefficient is beneficial for maintaining good compatibility under temperature changes. The thermal expansion coefficient of YB6016 and metal at 19 ppm/℃ indicates good compatibility between the two under temperature changes.
5. Glass:
   • Tensile strength: 3.1 MPa. The tensile strength reflects the bonding ability between silver paste and glass, and a tensile strength of 3.1 MPa indicates that Yanbo brand YB6016 has a certain bonding force with glass, demonstrating good compatibility.
   • Remaining deflection: 50%. The remaining deflection reflects the stability of silver paste on glass, and 50% of the remaining deflection indicates that YB6016 from Yanbo brand has a certain degree of stability on glass, thereby demonstrating good compatibility.
   • Thermal expansion coefficient: 8 ppm/℃. The close thermal expansion coefficient is beneficial for maintaining good compatibility under temperature changes. The thermal expansion coefficient between YB6016 and glass at 8 ppm/℃ indicates good compatibility between the two under temperature changes.

Experimental data shows that besides polymers, YB6016 from Yanbo brand exhibits good compatibility and stability with various other substrates, especially ceramics and metals, with excellent tensile strength, highlighting its advantages in high-strength conductive adhesive applications. If the compatibility between the silver adhesive and the substrate is poor, it may lead to insufficient adhesion of the silver adhesive on the substrate, affecting the conductivity or easy detachment during use.

5、 Conclusion

Based on the above experimental data analysis, we can conclude thatResearch Platinum YB6016 Low Temperature Curing Silver AdhesiveIt has good compatibility with various common substrates, especially suitable for application on substrates such as ceramics and metals. For engineers who need to apply low-temperature curing silver paste on various substrates, this will be a highly valuable reference data.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.