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Nano copper paste, as an important component of modern electronic materials, plays an increasingly important role in thin film circuit manufacturing due to its excellent conductivity, thermal conductivity, and antibacterial properties. This article will explore how to improve the conductivity of nano copper paste in thin film circuits through technological means, and specifically introduce the technology of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum YB5102 Nano Copper PasteApplication in this field.
Nano copper paste is formed by uniformly dispersing nanoscale copper particles in a specific solvent, and its unique physical and chemical properties give it extremely high specific surface area and surface activity. This characteristic makes the transmission of electrons between copper particles more efficient, thereby significantly improving the conductivity of the material.Nano copper pasteThis characteristic makes it an ideal material for preparing highly conductive thin films, electrodes, and other electronic components.
Optimize the dispersibility of nano copper particles
The dispersibility of nano copper particles in solvents directly affects their conductivity. By adjusting the type and concentration of dispersants, as well as controlling pH values and other conditions, significant improvements can be madecu nanoparticlesThe dispersion stability. For example, under the conditions of PVP concentration of 10g/L and pH value of 10 ± 0.5, copper colloids that are stable for more than 4 months can be prepared. This stable dispersion helps to form a uniform conductive network in thin film circuits, thereby improving conductivity.
Heat treatment modification
Heat treatment is one of the effective methods to improve the conductivity of nano copper paste. By high-temperature sintering, the organic coating layer on the surface of nano copper particles can be removed, allowing for tighter contact between copper particles and thus improving conductivity. For example, in an Ar gas atmosphere, by raising the temperature to 500 ℃ at a rate of 5 ℃/min and holding for 3 hours, a copper film with a resistivity of 2.5 × 10 Ω· cm can be obtained. Further controlling the organic content in the copper film before sintering can further reduce the resistivity to less than 10 μ Ω· cm.
Choose appropriate solvents and additives
The selection of solvents and additives also has a significant impact on the conductivity of nano copper paste. By selecting appropriate solvents and additives, the dispersion and stability of nano copper particles can be optimized, thereby improving conductivity. For example, using isopropanol as a solvent can prepare copper colloids with good dispersibility and stability.
Advanced Institute (Shenzhen) Technology Co., LtdYB5102 nano copper paste is a high-performance nano copper paste material with excellent conductivity, thermal conductivity, and stability. This material has broad application prospects in thin film circuit manufacturing.
high conductivity
The copper nanoparticles in YB5102 nano copper paste of Yanbo brand have extremely high specific surface area and surface activity, making the transfer of electrons between particles more efficient. By optimizing dispersion and heat treatment modification techniques, thin film circuits with extremely low electrical resistivity can be prepared. For example, after sintering under specific conditions, a copper film with a resistivity of less than 10 μ Ω· cm can be obtained.
Good processability and stability
YB5102 nano copper paste from Yanbo brand has good fluidity and printability, and can form patterned structures directly on substrates through various process methods. Meanwhile, its stability also provides possibilities for its application in various complex environments. This makes the YB5102 nano copper paste from Yanbo brand highly flexible and adaptable in thin film circuit manufacturing.
Widely applicable fields
Research Platinum YB5102 Nano Copper PasteNot only suitable for thin film circuit manufacturing, but also widely used in fields such as printed electronics, touch screen manufacturing, solar panel electrodes, etc. Its high conductivity and good printability make the manufacturing of electronic products more efficient and environmentally friendly.
Nano copper paste, as an important component of modern electronic materials, plays an increasingly important role in thin film circuit manufacturing. By optimizing the dispersibility of nano copper particles, heat treatment modification, and selecting appropriate solvents and additives, the conductivity of nano copper paste in thin film circuits can be significantly improved. Advanced Institute (Shenzhen) Technology Co., Ltd.'s YB5102 nano copper paste, a high-performance nano copper paste material, has excellent conductivity, thermal conductivity, and stability, and has broad application prospects in thin film circuit manufacturing. With the continuous advancement of preparation technology and the expansion of application fields, the future of nano copper paste will undoubtedly be brighter.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
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