20 micron thick polyimide film, PI film, heat-resistant film, double-sided aluminum plating is a high strength, high temperature resistance, high thermal stability, and high dielectric constant polymer material

20 micron thickness polyimide film PI film heat-resistant film double-sided aluminum platingIt is a high strength, high temperature resistance, high thermal stability, and high dielectric constant polymer material. Due to its excellent electrical and mechanical properties, it is widely used in the electronics and optical industries. Polyimide film can be divided into two categories, namely flexible polyimide film (FEP) and rigid polyimide film (TIP). Among them, rigid polyimide film is an important film material with high performance requirements:

(1) High mechanical strength, without significant internal stress, otherwise prone to rupture;

(2) Good dielectric performance and low dielectric loss, especially high-frequency dielectric performance;

(3) Good thermal stability and good thermal deformation temperature;

(4) Good optical performance, with good transmittance and low reflectivity;

(5) Has good dielectric properties, insulation, and heat resistance.

FEP film is an ideal composite film material made of pure polyimide, with a peel strength of over 60 MPa and a high temperature resistance of up to 200 ℃. TIP film is made of flexible polyimide, which has a lower thermal deformation temperature and good high temperature resistance. Its prominent feature is that it can be made into flexible materials that meet different requirements.

PI film is made of polyimide as the substrate (with a purity of over 99.9%) and produced through chemical processes; FEP film is made of resin as the substrate and processed through special techniques.

Polyimide filmIt has been widely used in fields such as electronics industry, aerospace, automotive, communication equipment, medical equipment, etc. In order to improve the processing performance of polyimide film materials, it is necessary to modify polyimide films. One of the methods is to use surface modification technology to coat a metal layer on the surface of polyimide film, which has the advantages of:

(1) By selecting different types of metals, thin films with varying properties can be obtained;

(2) Multiple metal layers can be simultaneously deposited on the same film surface to obtain composite films with complementary properties;

(3) Through reasonable design, the obtained film can have excellent heat resistance, chemical stability, mechanical properties, and optical properties. However, the thin film prepared by this method is prone to generating bubbles, so this method is generally not used.

Polyimide film is a flexible thin film material with excellent performance, used in the electronic, electrical, and optical industries. It is made by chemical processing of polyimide resin and manufactured by special molding equipment. Polyimide film has excellent properties such as high strength, high temperature resistance, high insulation, and heat resistance, as well as good optical performance, and is widely used in optical systems, laser systems, and other fields.

Polyimide film has good electrical properties, mechanical properties, and thermal stability, as well as good chemical stability and weather resistance. Polyimide film has a low thermal shrinkage rate under temperature changes and excellent resistance to permeation for most chemicals.

The mechanical properties of polyimide film mainly depend on the substrate, and are mainly affected by the surface treatment process of the substrate and the thickness of the film. With the improvement of substrate surface treatment technology, the mechanical properties of polyimide films have significantly improved. However, due to the small thermal expansion and contraction coefficient of polyimide film, cracks are prone to occur under high stress, leading to a sharp decrease in peel strength.

In order to improve the tensile strength of polyimide film, it can be subjected to heat treatment or mechanical stretching treatment, but cannot be subjected to high temperature and high pressure treatment.

Due to its excellent electrical, mechanical, and heat resistance properties, PI film is widely used in fields such as electronics, automotive, aerospace, etc. Polyimide film can be used to make many functional devices, such as FEP film used as an insulation layer, PI film can be used as a protective layer for electronic components, insulation layer for heat exchangers, electronic packaging materials, high-speed optical switches, fiber optic connection layers, and capacitors.

Packaging materials refer to the materials used in LED chip packaging, including chips, lead frames, and bases. Chips are the core of packaging and a key factor in determining product performance. Due to their small size, high density, and low power consumption, chips also have high requirements for product heat dissipation. The lead frame is the connection structure between LED devices and chips, and its main function is to isolate external interference signals. The base is the connection between the LED device and the chip, mainly used to support the chip and fix the PCB board.