Electrolytic copper foil with excellent electrical and thermal conductivity, high temperature ductility

Product specifications:

Advanced Institute Technology Company can provide PCB standards with a nominal thickness of 9-70 µ m and a width of 550mm to 1295mm, ranging from 1/4OZ to 2OZElectrolytic copper foil.

Product performance:

The product has excellent room temperature storage performance and high temperature oxidation resistance. The product quality meets the requirements of IPC-4562 standard level II and III, and meets the characteristics of standard contour (S), high temperature ductility (HTE), and electrolytic copper foil (see Table 1).

Product Usage:

Suitable for double-sided and multi-layer printed circuit boards with various resin systems.

Advantages of use:

This product adopts a special surface treatment process, which improves the product's resistance to bottom corrosion and reduces the risk of residual copper.

Metallographic analysis of product surface:

Table 1: Standard Profile (S), High Temperature Ductility (HTE), Copper Foil Characteristics (in accordance with GB/T5230-2000, IPC-4562A-2000 and other standards)