Efficient and environmentally friendly method for producing ITO conductive film with copper plating on the surface

1、 Introduction to Conductive Films

ITO conductive film is a transparent conductive film material widely used in fields such as liquid crystal displays, touch screens, photovoltaic cells, etc. At present, most ITO conductive films on the market are prepared on glass substrates. However, for flexible electronic devices, ITO conductive films on flexible substrates have more application prospects. And in the preparation of flexibilityITO filmThe copper coating on the surface is a crucial step in improving the conductivity and stability of ITO conductive films.

2、 The problems of traditional surface copper plating methods

In the traditional preparation process of flexible ITO conductive films, hot-dip copper plating is often used for surface copper plating, which has problems such as high energy consumption and environmental pollution. In addition, hot-dip copper plating often leads to an increase in substrate temperature, which affects the performance of flexible substrates and is not conducive to improving the stability of flexible ITO conductive films.

3、 New efficient and environmentally friendly surface copper plating method

In recent years, with the development of nanotechnology, a new efficient and environmentally friendly surface copper plating method has gradually attracted people's attention. This method uses chemical reduction to form a uniform copper coating on the ITO conductive film. Compared with the traditional hot-dip copper plating method, this method has the following advantages:

1. Low energy consumption: The chemical reduction copper plating process does not require heating and has low energy consumption;

2. High efficiency: Chemical reduction method can form a uniform copper coating in a short time;

3. Environmental Protection: The chemical reduction method does not produce toxic gases or wastewater, making it environmentally friendly;

4. Good adhesion: The copper coating prepared by chemical reduction method has good adhesion with ITO conductive film and is not easy to peel off.

4、 Experimental result verification

Researchers compared ITO conductive films prepared by traditional hot-dip copper plating and chemical reduction copper plating methods, and conducted comparative experiments in terms of conductivity, stability, and durability. The experimental results indicate that the chemical reduction method was used to prepareITO filmIn terms of conductivity and stability, the film prepared by traditional hot-dip copper plating method is superior, and exhibits better durability. This result further confirms the feasibility and advantages of chemical reduction as a novel method for surface copper plating.

5、 Conclusion and Prospect

In summary, chemical reduction method is adopted asSurface copper platingThe preparation method of ITO conductive film not only improves the performance and stability of the conductive film, but also has the advantages of low energy consumption and environmental protection. In the future, with the continuous development of nanotechnology and chemical engineering, this method will be more mature and widely applied in the field of flexible electronic devices, bringing more possibilities for the development of the electronics industry.