Thinning the surface modification layer of PI and PEN films to improve the adhesion between electroplated copper and nickel layers

In today's high-tech industry, the application of thin film materials is becoming increasingly widespread, among which polyimide (PI) and polyethylene terephthalate (PEN) films have attracted much attention due to their excellent physical properties and chemical stability. However, due to its smooth surface and chemical inertness, its application in fields such as electroplating is limited. Therefore, how toModified PI and PEN film surfacesOne of the current research hotspots is to achieve thinning and improve the adhesion between electroplated copper and nickel layers.

The Importance of Surface Modification Technology

The surface properties of thin film materials directly affect their bonding strength and functional properties with other materials. Surface modification technology can effectively change the surface properties of thin films by introducing active groups or micro nano structures, improve their affinity and binding force, and thus expand their applications in different fields. For PI and PEN films, surface modification technology can not only enhance their adhesion with electroplated copper and nickel layers, but also improve their chemical corrosion resistance and surface wettability, making them more widely applicable in fields such as electronics and optoelectronics.

Challenges and opportunities of thinning surface modified layers

However, thinning is both a challenge and an opportunity for surface modification of PI and PEN films. On the one hand, surface modification of the film requires an increase in its thickness to ensure the effectiveness and stability of the modification; On the other hand, some application scenarios require thinner films, which requires the surface modification layer to be as thin as possible to avoid affecting the overall performance of the film.

Methods and strategies for thinning the surface modified layer of thin films

In order to achieve thinning of the surface modified layer of PI and PEN films, researchers have proposed a series of methods and strategies. For example, new technologies such as ion implantation, plasma treatment, and surface modifier embedding can achieve surface modification effects without increasing the overall thickness of the film. Meanwhile, by optimizing the types and concentrations of modifiers, controlling the parameters and conditions of the modification process, thinning and uniformity of the surface modification layer can also be achieved.

Improvement of adhesion between electroplated copper and nickel layers

The PI and PEN films thinned by surface modification layer can better bond with electroplated copper and nickel layers, thereby improving overall bonding strength and stability. Surface modification technology can not only enhance the physical bonding between thin films and electroplating layers, but also improve their chemical and interfacial bonding, effectively reducing peeling and detachment problems caused by interfacial stress, making them more widely applicable in electronic components, flexible electronics, and other fields.

conclusion

in summary,Surface modification layer thinning of PI and PEN filmsImproving the adhesion between electroplated copper and nickel layers is one of the current research hotspots, and surface modification technology plays an important role in this process. In the future, we can further investigate the advantages and disadvantages of different surface modification methods, explore more thin film surface modification technologies, and apply them to a wider range of materials and fields, promoting the development and application of thin film materials in high-tech industries.