Technical exploration on enhancing the adhesion of platinum conductor paste after solidification or sintering

Platinum conductor pasteDue to its excellent conductivity and chemical stability, it has a wide range of applications in fields such as microelectronics, sensors, and fuel cells. However, in practical applications, the adhesion of platinum conductor paste is one of the key indicators of its performance. As a leader in the field of materials science, Advanced Institute (Shenzhen) Technology Co., Ltd. has explored various effective methods to enhance the adhesion of platinum conductor paste after solidification or sintering through in-depth research and practice.

1、 Optimize the slurry formula

The formula of the slurry is one of the key factors affecting its adhesion. The R&D team of Advanced Institute (Shenzhen) Technology Co., Ltd. has significantly improved the adhesion of platinum conductor paste by precisely adjusting the particle size of platinum powder, the type and content of additives, and the selection of solvents.

1. Platinum powder particle size: Selecting appropriate particle size platinum powder can help form a continuous and dense conductive network, thereby improving the adhesion and conductivity of the slurry.
2. Additives: By adding high-performance binders and other functional additives, the bonding force between the slurry and the substrate can be effectively enhanced, thereby improving adhesion.
3. Solvent: Choosing the appropriate solvent can optimize the leveling and printability of the slurry, making it easier to evenly coat on the substrate, thereby enhancing the adhesion after curing or sintering.

2、 Improve solidification or sintering processes

The curing or sintering process has a crucial impact on the adhesion of platinum conductor paste.Advanced Institute (Shenzhen) Technology Co., LtdBy optimizing the curing or sintering temperature and time, as well as introducing advanced co firing technology, the adhesion of platinum conductor paste has been significantly improved.

1. Curing or sintering temperature and time: Experimental data shows that as the curing or sintering temperature increases and the time prolongs, the adhesion of platinum conductor paste improves. However, excessive temperature and prolonged time may lead to a decrease in material properties. Therefore, it is necessary to find the optimal combination of curing or sintering temperature and time to achieve a balance between adhesion and other properties.

Taking the experimental data of Advanced Institute (Shenzhen) Technology Co., Ltd. as an example, the adhesion of the sample cured at 1000 ℃ for 90 minutes is 5 MPa, significantly higher than that of the sample cured at 800 ℃ for 30 minutes (adhesion of 3 MPa). This indicates that by increasing the curing or sintering temperature and prolonging the curing or sintering time, the adhesion of platinum conductor paste can be effectively enhanced.

2. Co firing technology: Advanced co firing technology is used to achieve integrated sintering of platinum slurry and other materials. This method not only simplifies the production process, but also improves the reliability and consistency of the product, thereby helping to enhance adhesion.

3、 Surface treatment and substrate selection

In addition to optimizing the slurry formula and improving the curing or sintering process, surface treatment and substrate selection are also key measures to enhance the adhesion of platinum conductor slurry.

1. Surface treatment: Proper surface treatment of the substrate, such as cleaning, degreasing, roughening, etc., can significantly improve the adhesion between the slurry and the substrate.
2. Substrate selection: Choosing the appropriate substrate is also key to enhancing adhesion. The material, surface properties, and thermal expansion coefficient of different substrates can all affect the adhesion of the slurry. Therefore, when selecting a substrate, it is necessary to fully consider its compatibility and compatibility with the slurry.

4、 Application examples and prospects

Advanced Institute (Shenzhen) Technology Co., LtdPlatinum conductor pasteSignificant achievements have been made in enhancing adhesion, providing strong support for technological progress and industrial upgrading in related fields. For example, in sensor manufacturing, the sensitivity and stability of sensors have been significantly improved by optimizing the slurry formulation and curing or sintering processes; In the field of microelectronic packaging, efficient connection and stable performance between electronic components have been achieved by enhancing the adhesion of the paste.

Looking ahead to the future, with the continuous advancement of technology and the deepening expansion of applications, platinum conductor paste will demonstrate its unique charm and value in more fields. Advanced Institute (Shenzhen) Technology Co., Ltd. will continue to devote itself to the research and development of platinum conductor paste, promoting its application and development in new energy, environmental protection and other fields.

conclusion

enhancePlatinum conductor pasteThe adhesion after solidification or sintering is a complex and meticulous task that requires comprehensive consideration of multiple factors such as slurry formulation, solidification or sintering process, surface treatment, and substrate selection. Advanced Institute (Shenzhen) Technology Co., Ltd. has explored various effective methods and measures through in-depth research and practice, providing strong support for the application and development of platinum conductor paste. In the future, with the continuous advancement and innovation of technology, the application prospects of platinum conductor paste will be even broader.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.