High frequency flexible copper-clad laminates are mainly used in mobile phones, communication devices, computers, MEMS sensors, medical equipment, and military electronic equipment

    High frequency flexible copper-clad laminateIt is a high-performance circuit board that is an electronic component with a flexible substrate covered with copper foil, providing a reliable foundation material for the production of circuits.
Copper clad laminate (CCL) is a plate-shaped material made by immersing electrons or other materials, covering one or both sides, and hot pressing, abbreviated as CCL. The main raw materials for the production of copper-clad laminates include copper foil, fiberglass cloth, resin, and wood pulp. Copper clad laminates are mainly divided into rigid copper-clad laminates and flexible copper-clad laminates. By selectively processing copper-clad laminates into printed circuit boards, they can be applied in fields such as communication equipment, automotive electronics, consumer electronics, industrial control, aerospace, and computers.
The main components of high-frequency flexible copper-clad laminates are copper foil (usually 12-70 μ m thick), flexible substrate (film or honeycomb laminate), and specific adhesives. Its performance is mainly determined by the thickness of the copper foil, the substrate material, and the adhesive.
Due to the higher circuit frequency required for high-frequency circuits, the conductivity and performance requirements of the circuit board are also higher. High frequency flexible copper-clad laminates not only have good conductivity and flexibility, but also have advantages that other circuit boards do not have, such as good high-frequency characteristics, low transmission loss, good thermal performance, high reliability, etc. Therefore,High frequency flexible copper-clad laminateIt is not only suitable for electronic products, computer communication and other fields, but also gradually applied to medical, aviation manufacturing, military and other fields, and its application areas have been expanding.

1. Good high-frequency characteristics and low transmission loss. This material, due to its high conductivity and excellent electrical properties, can be used for electronic applications at high-performance radio frequencies.
2. Better thermal performance. This material has good heat resistance and low temperature resistance, and can withstand extreme environments of high and low temperatures.
3. Relatively high mechanical strength and tensile strength. This material can not only withstand high forces, but also has good followability under any irregular shaped surface.
4. Flexibility. As the usage location changes, high-frequency flexible copper-clad laminates can be folded freely like paper and easily combined or connected with objects.
5. Strong anti-interference ability. Due to its excellent shielding performance, copper-clad laminates can block external electronic signals and reduce electronic interference.
     High frequency flexible copper-clad laminateMainly used in fields such as mobile phones, communication devices, computers, MEMS sensors, medical equipment, military electronic equipment, etc. Due to its excellent stability and communication performance, it is widely used in 5G mobile communication solutions, and its future application prospects are very broad.