In many metal material application scenarios,Gold-plated copper foilThe bonding with other metal materials is a significant technical operation. How to ensure the reliability of this bonding connection is a focus of concern for many technicians, and Advanced Institute (Shenzhen) Technology Co., Ltd. also has in-depth research and rich experience in this field.
1、 Application scenarios for bonding gold-plated copper foil with other metal materials
- In the electronics industry, such as the manufacturing of printed circuit boards (PCBs). Gold plated copper foil may need to be bonded with metal materials such as tin and nickel to meet the requirements of circuit conductivity and corrosion resistance. In this scenario, the reliability of the connection is directly related to the performance and service life of the PCB. According to relevant research, the stability of PCB in electronic products has a crucial impact on the overall quality of the product.
2、 Factors affecting the reliability of bonding connections
（1） Surface treatment
- Cleanliness:
- Gold-plated copper foilThe surface of the metal material to be bonded must be kept highly clean. The presence of any dust, oil stains, or oxides can affect the bonding effect. In experiments conducted by Advanced Institute (Shenzhen) Technology Co., Ltd., it was found that even tiny dust particles can form gaps on the bonding surface, leading to poor connections. Therefore, appropriate cleaning methods such as chemical cleaning, plasma cleaning, etc. need to be used before bonding to remove surface contaminants.
- For gold-plated copper foil, the gold plating layer on its surface should also be kept clean, because if the gold plating layer is contaminated, it may affect the intermolecular forces with other metals.
- Roughness:
- Surface roughness can affect the contact area during bonding. If the surface is too rough, the actual contact area will decrease during bonding, thereby reducing the reliability of the connection. If the surface is too smooth, it may affect the intermolecular adsorption force. Taking the bonding of copper foil and aluminum as an example, Advanced Institute (Shenzhen) Technology Co., Ltd. has found through experiments that a suitable roughness range can increase the bonding strength between the two by about 30%.
（2） Bonding process
- Pressure control:
- It is crucial to apply appropriate pressure during the bonding process. Insufficient pressure can lead to loose adhesion, while excessive pressure may damage the material or the gold plating layer. When gold-plated copper foil is bonded to nickel metal,Advanced Institute (Shenzhen) Technology Co., LtdResearch has found that within a specific pressure range, the connection reliability between the two can be optimized, and this pressure range needs to be precisely adjusted based on the material's thickness, hardness, and other characteristics.
- Temperature control:
- Temperature also has a significant impact on bonding connections. The thermal expansion coefficients of different metal materials vary at different temperatures. If the temperature control is improper during the bonding process, it may cause stress to be generated when the temperature changes after bonding, thereby damaging the connection. In some experimental projects of Advanced Institute (Shenzhen) Technology Co., Ltd., for the bonding of gold-plated copper foil and tin metal, the temperature during bonding is precisely controlled to ensure that the connection between the two remains reliable even in temperature changing environments.
（3） Material compatibility
- Chemical reactions between metals:
- Gold-plated copper foilChemical reactions may occur after bonding with other metal materials. For example, certain metal combinations may form intermetallic compounds, and if the formation of these compounds is not controlled, it may lead to brittle connections or corrosion. Researchers at Advanced Institute (Shenzhen) Technology Co., Ltd. predict possible chemical reactions in advance by studying the chemical properties of different metal combinations, and take corresponding measures such as adding isolation layers to ensure the reliability of the connection.
- Potential difference:
- There is a potential difference between different metals, which may lead to galvanic corrosion. In the bonding connection, the influence of this potential difference needs to be considered. For example, when gold-plated copper foil is bonded to another metal with a large potential difference, galvanic corrosion is prone to occur in humid environments, thereby damaging the connection. Advanced Institute (Shenzhen) Technology Co., Ltd. has adopted special coating technology or selected metal combinations with small potential differences to avoid such situations.
3、 Technical measures to ensure connection reliability
（1） Use appropriate adhesive
- Selection of Adhesive:
- Choose products with good bonding properties andGold-plated copper foilAdhesive with good compatibility with other metal materials. For example, some epoxy adhesives perform well in many metal bonding scenarios. Advanced Institute (Shenzhen) Technology Co., Ltd. has tested various adhesives and found that some modified adhesives can effectively fill the small gaps on the bonding surface of gold-plated copper foil and other metal materials, improving the reliability of the connection.
- Coating process of adhesive:
- The coating thickness and uniformity of the adhesive will affect the connection effect. Accurate coating processes such as spraying, screen printing, etc. are required to ensure that the adhesive is evenly distributed on the bonding surface. Advanced Institute (Shenzhen) Technology Co., Ltd. has developed an automated adhesive coating equipment that can accurately control the coating thickness and uniformity, improving the reliability of the connection between gold-plated copper foil and other metal materials.
（2） Using physical connection assistance methods
- Welding:
- In some scenarios where high connection strength is required, welding can be used to assist in bonding connections. For example, for the bonding of gold-plated copper foil and copper alloy, spot welding around the bonding surface can enhance the stability of the connection. Advanced Institute (Shenzhen) Technology Co., Ltd. has optimized welding parameters such as welding current, time, etc. in relevant research to ensure that the welding process will not cause damage to the gold plating layer and other metal materials, while improving the reliability of the connection.
- Riveting:
- For the bonding between thicker metal materials and gold-plated copper foils, riveting can be considered. By setting rivets at specific locations, it is possible to effectively prevent the mating surface from separating when subjected to external forces. Advanced Institute (Shenzhen) Technology Co., Ltd. has designed a special rivet structure and installation process in practical applications, which enables riveting to play a good auxiliary role in the bonding connection between gold-plated copper foil and other metal materials.
In summary, to ensure the reliability of the connection between gold-plated copper foil and other metal materials during bonding, it is necessary to consider multiple aspects such as surface treatment, bonding process, material compatibility, and take appropriate technical measures. Advanced Institute (Shenzhen) Technology Co., Ltd. continuously explores and innovates in this field, providing valuable experience and technical support to improve the reliability of this bonding connection.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
en 
