FPC (Flexible Printed Circuit Board) related components PI single-sided copper plated film

With the popularization and continuous upgrading of electronic products,FPCSFPC, as a lightweight, flexible, bendable, and foldable electronic component, is receiving increasing attention from the electronics industry. As an important component of FPC, PI single-sided copper plated film is a key material to ensure the electrical and mechanical performance of FPC. This article will introducePI single-sided copper plated filmThe preparation process, performance characteristics, and application fields of.

The preparation process of PI single-sided copper plating film mainly includes three steps: surface treatment of PI substrate, copper chemical coating, and post-treatment.

1. PI substrate surface treatment is aimed at increasing the hydrophilicity of the substrate surface, improving the adhesion and uniformity of the copper film. Generally, methods such as oxidation treatment, plasma treatment, and solvent cleaning are used.

   
   

2. Copper chemical coatingCopper chemical coatingIt is the process of immersing the PI substrate in a chemical plating solution containing copper ions, and reducing the copper ions to a copper film through a chemical reaction. The copper ions in the plating solution are absorbed by electrons during the reduction process, and the reduced copper atoms deposit a copper film on the surface of the PI substrate. Copper chemical coating requires controlling factors such as the composition, temperature, pH value, current density, and stirring of the plating solution to control the thickness and uniformity of the copper film.

   
   

3. After the copper film is plated, post-treatment is required to improve the adhesion and corrosion resistance of the copper film. Generally, methods such as hot pressing, UV irradiation, and heat treatment are used.

The performance characteristics of PI single-sided copper plated film are as follows:

1. Excellent conductivity: Copper is an excellent conductive material, and the conductivity of PI single-sided copper plated film is excellent, suitable for high-frequency and high-speed transmission of electronic products.

   
   

2. Excellent mechanical properties: The PI substrate has excellent flexibility and elasticity, while the thin thickness of the copper film ensures the flexibility and bendability of the FPC.

   
   

3. Good corrosion resistance: The PI single-sided copper plated film has good corrosion resistance and can be used in harsh environments. PI single-sided copper plated film is widely used in flexible electronic products such as FPC, flexible screens, and flexible solar cells. Among them, FPC is one of the most widely used flexible electronic products, mainly used for connecting electronic components, transmitting signals, and transmitting power. As an important component of FPC, PI single-sided copper plated film ensures the electrical and mechanical performance of FPC. With the increasing application of FPC in electronic products, the demand for PI single-sided copper plated film is also growing.

   
   

summarize
        PI single-sided copper plated filmIt is an important component of FPC, ensuring the electrical and mechanical performance of FPC. The preparation process of PI single-sided copper plating film mainly includes three steps: surface treatment of PI substrate, copper chemical coating, and post-treatment. It has excellent conductivity, excellent mechanical properties, and good corrosion resistance, and is widely used in flexible electronic products such as FPC, flexible screens, and flexible solar cells. When using PI single-sided copper plating film, it is necessary to choose appropriate processes and equipment to control the film thickness and uniformity, in order to obtain high-quality copper film.