Functional PI film coated with aluminum and copper

Brief introduction

     Functional PI filmIt is a high-performance material of polyimide, characterized by high temperature stability, corrosion resistance, excellent electrical performance, etc. It is widely used in fields such as electronics and aerospace. This article will introduce the aluminum and copper plating processes and their applications of functional PI films.

2、 Functional PI film aluminum plating process

The aluminum plating of functional PI film can be achieved through two methods: vacuum coating and chemical aluminum plating

(1) Vacuum coating:
Vacuum coating is a method of placing aluminum powder or aluminum wire in a vacuum chamber, heating it to high temperature, and then evaporating and depositing it on the surface of a PI film. Vacuum coating requires controlling the coating time and temperature to control the thickness and uniformity of the aluminum film. The advantage of vacuum coating is that it can prepare high-quality aluminum film, but the disadvantages are high equipment cost, low production efficiency, and certain thermal damage to the film substrate.

(2) Chemical aluminum plating:
Chemical aluminum plating is a method of immersing PI film in a solution containing aluminum ions, and reducing aluminum ions to aluminum film through electrochemical reaction. Chemical aluminum plating requires controlling the soaking time, temperature, and solution composition to control the thickness and uniformity of the aluminum film. The advantages of chemical aluminum plating are low equipment cost, low preparation temperature, and no thermal damage to the film substrate.

3、 Functional PI film copper plating process

The copper plating of functional PI film can be achieved through two methods: electroplating and electroless copper plating:

(1) Electroplating:
    Electroplating is the process of using a PI film as a cathode to reduce copper ions in an electrolyte containing copper ions copper filmThe method. Electroplating requires controlling the electroplating time, current density, and electrolyte composition to control the thickness and uniformity of the copper film. The advantage of electroplating is that it can prepare high-quality copper films, but the disadvantages are high equipment costs, complex preparation processes, and certain electrochemical effects on the film substrate.

(2) Chemical copper plating:
    Chemical copper plating is a method of immersing PI film in a solution containing copper ions, and reducing copper ions to copper film through chemical reactions. Chemical copper plating requires controlling the soaking time, temperature, and solution composition to control the thickness and uniformity of the copper film. The advantages of electroless copper plating are low equipment cost, simple preparation process, and no electrochemical effect on the film substrate.

4、 Application of functional PI film aluminum plating and copper plating

Aluminum and copper plating of functional PI films can improve their conductivity and mechanical strength, expanding their application fields. For example, copper plated PI film can be used to manufacture high-density circuit boards, flexible circuits, and other electronic products, while aluminum plated PI film can be used to manufacture corrosion-resistant and high-temperature resistant aviation components. In addition, aluminum and copper plating of functional PI films can also be combined with other materials, such as combining with organic optoelectronic materials to prepare flexible OLEDs and other optoelectronic devices.

5、 Summary

Aluminum and copper plating of functional PI films are key technologies for expanding the application and improving their performance. Aluminum plating can be achieved through two methods: vacuum coating and chemical aluminum plating, while copper plating can be achieved through two methods: electroplating and chemical copper plating. The application of these technologies can expand the scope of PI films in fields such as electronics and aerospace, and enhance their application value. When using these technologies, it is necessary to choose appropriate processes and equipment to control film thickness and uniformity, in order to obtain high-quality aluminum and copper films.