The influence of formulation composition of low-temperature curing silver adhesive on its curing temperature range

In modern electronic manufacturing,Low temperature curing silver adhesiveAs an ideal conductive connecting material, it is gradually replacing traditional lead tin welding due to its low-temperature curing, high conductivity, excellent bonding performance, and environmental advantages. This article will explore how the formula composition of low-temperature curing silver adhesive affects its curing temperature range, and combine it with reference data, experimental data, and the research of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB6016 Low Temperature Conductive Silver AdhesiveConduct analysis.

Formula composition of low-temperature curing silver adhesive

The main components of low-temperature cured silver paste include matrix resin, conductive filler, curing agent, stabilizer, promoter, anti precipitation agent, and silane coupling agent. Taking a low-temperature rapid curing conductive silver adhesive as an example, its formula is as follows:

• Conductive filler (mixture of silver powder and graphene): 65-85%
• Epoxy resin: 6-25%
• Curing agent: 3-20%
• Stabilizer: 0.2-5%
• Accelerator: 0.1-2%
• Anti precipitation agent: 0.1-2%
• Silane coupling agent: 0.1-2%

This formula design enables conductive silver paste to quickly cure at lower temperatures, thereby avoiding damage to electronic devices caused by high temperatures.

The influence of curing temperature range

1. Selection of curing temperature

   conventionalConductive silver adhesiveUsually, a higher curing temperature is required. For example, epoxy resin adhesives usually require low-temperature curing from room temperature to 150 ℃, while some special formulations of low-temperature curing silver adhesives, such as YB6016, can have a curing temperature as low as 75 ℃ and can be fully cured within 45 minutes.

2. The influence of curing temperature on performance

   According to test data from Advanced Institute (Shenzhen) Technology Co., Ltd., the resistivity of YB6016, a platinum based material, increased by only about 10% at -40 ° C compared to room temperature (25 ° C). However, at -30 ° C, its adhesion to materials such as ceramics and metals decreased by only 5% to 10% compared to room temperature. These data indicate that the formulation design of YB6016 platinum enables it to maintain good conductivity and bonding performance at low temperatures.

3. Performance comparison under low temperature environment

   Compared with ordinary conductive silver paste, YB6016 has significant performance advantages in low-temperature environments. For example, in an environment of -20 ° C, the resistivity of some ordinary conductive silver adhesives will increase by 30% to 50% compared to room temperature, while the adhesion to some materials will decrease by 20% to 40%. In contrast, the increase in resistivity and decrease in bonding strength of YB6016 are relatively small, thanks to its special formula design, which allows its polymer matrix to maintain good flexibility and intermolecular forces at low temperatures.

4. Optimizing curing temperature for performance improvement

   The study also found that increasing the curing temperature appropriately (within the allowable range of the material) can further improve the performance of silver paste at low temperatures. For example, willResearch Platinum YB6016After increasing the curing temperature from the standard 80 ° C to 90 ° C, the electrical resistivity further decreased by about 5% and the bonding strength increased by about 3% in an environment of -20 ° C. This discovery provides new ideas for the application of conductive silver paste in low-temperature environments.

conclusion

Low temperature curing silver adhesiveThe composition of the formula has a significant impact on its curing temperature range. By optimizing formula design, such as using special conductive fillers, epoxy resins, and curing agents, low-temperature rapid curing can be achieved while maintaining excellent conductivity and bonding properties. The successful case of YB6016 low-temperature conductive silver adhesive for platinum research shows that conductive silver adhesive designed for low-temperature environments can significantly improve the conductivity and connection performance of equipment, and reduce the failure rate.

In the future, with the continuous development of electronic manufacturing technology, the application scope of low-temperature curing silver paste will be further expanded. Enterprises and research institutions should continue to explore new formula designs and technological optimizations to meet the needs of different application scenarios and promote the wider application of conductive silver adhesives in low-temperature environments.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.