The influence of nickel plating layer purity on the conductivity of nickel plated copper foil

In the modern electronics industry,Nickel plated copper foilAs a high-performance material, it is widely used in the manufacturing of PCB (printed circuit board) and various electronic devices. The conductivity of nickel plated copper foil is one of its core performance indicators, and the purity of the nickel plating layer has a significant impact on this performance. This article will explore in detail the influence of the purity of the nickel plating layer on the conductivity of nickel plated copper foil, and explain it in combination with the practical experience of Advanced Institute (Shenzhen) Technology Co., Ltd.

1、 Basic characteristics of nickel plated copper foil

Nickel plated copper foil is a composite material that is coated with a layer of nickel on the surface of copper foil, which has excellent conductivity, corrosion resistance, and processability. The purity of copper foil is usually above 99.5%, and high purity helps to improve conductivity and reduce electrical problems caused by impurities. The nickel plating layer can effectively prevent oxidation and corrosion, maintain the stability of the substrate surface, and extend its service life.

2、 The influence of nickel plating purity on conductivity

The purity of the nickel plating layer is one of the key factors affecting the conductivity of copper foil. A high-purity nickel plating layer means low impurity content, which reduces the scattering and obstruction of electrons during transmission and improves conductivity efficiency.

1. Improvement of conductivity performance

   • High purity nickel plating layer: When the purity of the nickel plating layer reaches 99.9% or above, the conductivity of the copper foil is significantly improved. The high-purity nickel plating layer reduces the scattering of electrons at the interface, allowing current to pass through more smoothly.
   • Conductivity data: toAdvanced Institute (Shenzhen) Technology Co., LtdTaking nickel plated copper foil products as an example, the purity of the nickel plating layer reaches 99.95%, and the conductivity is about 10% higher than that of low purity nickel plating layers (such as less than 99.0%).

2. Optimization of corrosion resistance performance

   • High purity nickel plating layer: High purity nickel plating layer not only improves the conductivity, but also significantly enhances the corrosion resistance of copper foil. The nickel plating layer can effectively prevent oxidation and corrosion, and maintain the stability of the substrate surface.
   • Corrosion resistance data: In the salt spray test,High purity nickel plated copper foilThe corrosion resistance time of (99.95%) is about 30% longer than that of low purity nickel plated copper foil.

3. Matching of thermal expansion coefficient

   • High purity nickel plating layer: The high-purity nickel plating layer is more compatible with the thermal expansion coefficient of copper foil, reducing size changes and mechanical stress caused by thermal stress during temperature changes, and improving the dimensional stability and mechanical stress of PCB at different temperatures.
   • CTE data: The CTE (coefficient of thermal expansion) of high-purity nickel plated copper foil is closer to that of copper foil, with a difference controlled within ± 5%, significantly improving the reliability of PCB.

3、 Practice of Advanced Institute (Shenzhen) Technology Co., Ltd

Advanced Institute (Shenzhen) Technology Co., Ltd., as an enterprise specializing in the research and sales of new materials such as precious metal coatings, electronic pastes, shielding materials, and absorbing materials, has significant advantages in the nickel plated copper foil products in the market.

• High purity nickel plating technology: The company adopts advanced electroplating technology to ensure that the purity of the nickel plating layer reaches over 99.95%, significantly improving the conductivity and corrosion resistance of the copper foil.
• Strict quality control: The company strictly controls the production process of nickel plated copper foil, from raw material selection to electroplating process, every step is carefully designed and rigorously tested to ensure stable and reliable product quality.
• Customer application feedback: In the actual application of customers, the nickel plated copper foil products of Advanced Institute (Shenzhen) Technology Co., Ltd. have shown excellent conductivity and corrosion resistance, and have received unanimous praise from customers.

4、 Conclusion

in summary,Nickel plated copper foilThe purity of the nickel plating layer has a significant impact on the conductivity of copper foil. The high-purity nickel plating layer not only improves the conductivity efficiency, but also enhances the corrosion resistance and thermal expansion coefficient matching of the copper foil. Advanced Institute (Shenzhen) Technology Co., Ltd. has ensured the high quality and performance of nickel plated copper foil products through advanced electroplating processes and strict quality control, making important contributions to the development of the electronics industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.