Technical Strategy for Improving the Deposition Rate and Quality of PI Aluminum Coating Aluminum Layer

1. Introduction

PI aluminum plated film combines the excellent mechanical properties of polyimide with the good conductivity and reflection characteristics of aluminum layer, and is widely used in flexible circuit boards, thermal control systems, and various optical devices. With the development of technologyPI aluminum plated filmThe requirements are also constantly increasing, especially in terms of aluminum layer deposition rate and quality. How to significantly improve sedimentation rate while ensuring quality has become the focus of current research.

2. Factors affecting the deposition rate and quality of aluminum layer

2.1 Substrate pretreatment

The surface condition of the substrate directly affects the adhesion effect of the subsequent aluminum layer. The untreated PI surface may contain pollutants or have lower surface energy, which is not conducive to the good deposition of aluminum layer. Therefore, effective surface pretreatment is the foundation for improving sedimentation rate and quality.

2.2 Aluminum plating process parameters

Multiple process parameters, including vacuum degree, temperature, current density, etc., can affect the deposition process of the aluminum layer. For example, a suitable vacuum environment can reduce impurity interference and ensure uniform deposition; Proper temperature control can help improve the migration behavior of aluminum atoms and promote the formation of dense structures.

2.3 Aluminum source selection

The choice of aluminum source determines the quality of the final coating. High purity aluminum target materials can provide purer evaporated substances, resulting in better coating quality. In addition, different forms of aluminum sources (such as block and powder) can also affect deposition efficiency.

2.4 Equipment Performance

Advanced coating equipment is crucial for achieving efficient aluminum layer deposition. A stable power supply, precise temperature control system, and efficient exhaust device are all indispensable parts to ensure good coating quality.

3. Methods to improve the deposition rate and quality of aluminum layer

3.1 Surface pretreatment optimization

Advanced Institute (Shenzhen) Technology Co., LtdThrough experiments, it was found that plasma treatment, ultraviolet irradiation, chemical etching, and other methods can significantly improve the surface activity of PI, creating favorable conditions for aluminum layer deposition. Especially plasma treatment can effectively remove surface organic pollutants without damaging the substrate, while introducing more active sites to promote better adhesion of the aluminum layer.

3.2 Process parameter adjustment

Reasonably setting aluminum plating process parameters according to different application requirements is key. The company has validated a set of optimal parameter combinations through extensive experiments: maintaining a high but not excessive vacuum degree (usually below 10 ^ -5 Pa), controlling the appropriate operating temperature range (about 200 ° C-300 ° C), and selecting a moderate current density to balance the relationship between deposition rate and mass.

3.3 Development of new aluminum sources

Exploring new aluminum sources is also one of the important ways to improve deposition rates. Advanced Institute (Shenzhen) Technology Co., Ltd. has developed aNew nanoscale aluminum powderAs an evaporative material, this aluminum powder not only has higher reactivity, but its small particle size helps accelerate the deposition process, forming a denser and smoother aluminum layer.

3.4 Equipment Upgrade and Innovation

Investing in the research and introduction of high-end coating equipment cannot be ignored. The company has introduced an internationally leading magnetron sputtering coating machine, which is equipped with multi-target co sputtering function and can complete composite coating of multiple materials on the same platform, greatly improving production efficiency. In addition, an advanced online monitoring system is adopted to monitor the thickness and uniformity of the coating in real time, ensuring that each rollPI aluminum plated filmAll meet high-quality standards.

4. Application case analysis

With the rise of flexible electronic products, there is an increasing demand for PI aluminum plated films that are lightweight, flexible, and have good conductivity. Yanbo brand PI aluminum plated film, with its excellent performance, has been selected by many well-known mobile phone manufacturers as one of the key components of the new generation of foldable screen phones. It not only achieves effective protection of the screen bending area, but also improves the overall device's heat dissipation performance.

5. Conclusion

In summary, improving the deposition rate and quality of PI aluminum coating requires comprehensive consideration of multiple factors. From surface pretreatment to process parameter adjustment, to the development of new aluminum sources and equipment upgrades, every link is closely connected. Advanced Institute (Shenzhen) Technology Co., Ltd. has provided customers with a series of efficient and reliable solutions through continuous technological innovation and strict quality control, promoting the healthy development of the PI aluminum coating industry. In the future, with the application and development of more new technologies, we believe there will be more breakthrough progress waiting for us to explore.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.