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Ultra fine copper powder, high-purity copper powder, nano copper powder, Cu spherical copper powder, 3D printed copper for microelectronic devices

Time:2022-10-16Number:1305

Nano copper powder and ultrafine copper powder are prepared by variable current laser ion beam gas-phase method, with large industrial yield, spherical shape, uniform particle size, high crystallinity, high product purity, high surface active energy, easy dispersion and industrial application.

Main parameters:

Product classificationmodelAverage particle size (nm)Purity (%)Specific surface area (m2/g)Bulk density (g/cm3)Crystal formcolour

NanoscaleYB-Cu-00160>99.918.00.30sphereblack brown

Submicron scaleYB-Cu-002500>99.54.501.30spherered

Customized processingAdjust product purity and particle size appropriately according to customer needs

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Purpose:

1 nanometer copper powder and ultrafine copper powder can be used for the production of microelectronic devices and for the terminal of multi-layer ceramic capacitors;

2 can also be used as a catalyst in reactions such as the synthesis of methanol from carbon dioxide and hydrogen;

3. Treatment of conductive coatings on metal and non-metal surfaces;

4. Conductive paste, used as petroleum lubricant and pharmaceutical industry;

5-nanometer copper is suitable for electronics, electronic technology, instrument manufacturing, automotive, aviation, machinery manufacturing, chemical industry, as well as the production of metal products, specialized paints, and building materials;

6-nanometer copper is widely used in the production of powder metallurgy, hard alloys, diamond tool products, electric carbon products, handicrafts, friction materials, non-ferrous metal alloys, as well as in the production of anti-static products and special coatings, chemical agents, chemical dye additives, lubricants and other products.

 

Advanced Institute (Shenzhen) Technology Co., Ltd. can provide technical support for the application of nano copper powder and ultrafine copper powder products in the production of microelectronic devices, conductive coating treatment of metal and non-metal surfaces, electronics, electronic technology, instrument manufacturing, automotive, aviation, machinery manufacturing, chemical industry, and metal products.

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