Microcapsule anisotropic conductive adhesive for bare chip installation

Advanced Institute of TechnologyAnisotropic conductive adhesivePreviously, there seemed to be models such as 3370c and 3370g, and later there seems to be an upgraded version such as 33743374c: viscosity: 20000cps； Curing conditions: Heating under pressure at 150-230 degrees Celsius for 5-100 seconds; Storage conditions: -20 degrees Celsius for 6 months! This TDS also includes reliability test data such as high temperature and high humidity (85 ℃ 85% RH) PCT experiment (121 ℃ 2atm) and thermal shock (-55/125 ℃ for 30 minutes each)!

Advanced Institute Technology 3372C is an anisotropic conductive adhesive of microcapsule (MC) type that can harden within 230 ℃ x 3 seconds for bare chip mounting. This product uses microencapsulated conductive fillers coated with excellent insulation and moisture resistance resin on spherical silver particles with uniform particle size, which can achieve precise grid spacing connection. In addition, compared with similar adhesives in the past, it can significantly shorten the curing time and greatly improve production efficiency.

·Compared with gold-plated resin balls, this product has lower and more stable connection resistance.

·A protrusion of 80 μ m can be energized with 4000mA.

·Conductive particles have an insulating coating that enables precise grid spacing connections.

·Electrical connection and resin sealing can be carried out simultaneously, simplifying the installation process.