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Epoxy conductive adhesiveIt is a clever combination of high-strength epoxy adhesive and highly conductive silver particles. It has multiple advantages such as room temperature curing, high adhesive strength, wide range of conductive temperature, and easy operation.
Application: Metal to metal bonding, printed circuit board wiring connection, microwave component lead connection, metal mesh shielding strip bonding
Usage: For conductive adhesive weighing less than 10 grams, remove the prepared two-component barrier and mix evenly before use. The conductive adhesive that can be applied with 85 needs to be mixed evenly with the cured extrusion in a ratio of 100:6.3 by weight before use.
Technical parameters:
Body resistance: 0.002 Ω
Adhesive shear strength: 84kg/cm2
Working temperature: -55 ℃~125 ℃
Operation time: 30 minutes
Greenhouse curing time (25 ℃): 24 hours
High temperature curing time (113 ℃): 15 minutes
Storage period: 3 years
Coating area: 156cm2/g
Silicone grease conductive adhesive is a clever combination of the high viscosity of silicone grease and the high conductivity of metal particles. According to the composition, it can be divided into single component and two-component; According to the filled conductive particles, they can be divided intoSilver filled silicone grease adhesive, nickel filled silicone grease adhesive, copper silver plated silicone grease adhesive, aluminum silver plated silicone grease adhesive, graphite nickel plated conductive adhesiveWait.
Among them, 1030 is a component of RTV silicone, which solidifies when exposed to moderate humidity and has a tear strength twice that of other RTV silicone and a lap shear strength of 200psi (1.38MPa). For higher conductivity, the thickness of the adhesive layer should not exceed 10 mil. For proper curing, the width should not exceed 0.5 inches (1.27cm). The material solidifies at a standard pressure of 1-2 psi (0.01 Mpa) and a temperature not exceeding 66 ℃.
Application: Conductive rubber sheet and metal bonding, conductive rubber strip and metal bonding
Usage: Be sure to clean the surface that needs to be bonded before operating according to the regulations.
Technical parameters:
Body resistance: 0.05 Ω
Peel strength: 14Kg/cm2
Working temperature:- 55℃~200℃
Operation time: 30 minutes
Greenhouse curing time: 7 days
Storage period: 6 months
Adhesive area: 18.5cm2/g
Adhesive bonding thickness: less than or equal to 0.03mm
Packaging: 114g/set
3、 Technical specification list
CHO-BOND |
YB-29 |
YB-208 |
YB-1029 |
YB-1030 |
YB-1085 |
YB-1086 |
adhesive |
epoxy |
epoxy |
Silicon copper |
Silicon copper |
Primer, used for 1029 |
Primer, used for 1030,1075 |
filler |
Ag |
Ag |
Ag/Cu |
Ag/Cu |
||
by weight |
100:6.3 |
1:1 |
1.0:2.5 |
Single component |
Single component |
Single component |
Thick viscosity |
Thick paste agent |
Medium viscosity agent |
Thick paste agent |
Sand containing paste |
Dilute fluid |
Dilute fluid |
Performance ratio |
2.5±0.20 |
2.7±0.20 |
3.0±0.35 |
3.75±0.55 |
0.87±0.15 |
0.75±0.10 |
Overlapping shear strength Psi(Mpa) |
1200 |
700 |
450(3.11) |
200(1.38) |
not suitable |
not suitable |
DC volume Electrical resistivity ohm cm |
0.0 |
0.05 |
0.06* |
0.05 |
not suitable |
not suitable |
Usage temperature |
-55~125℃ |
-62~99℃ |
-55~125℃ |
-55~200℃ |
-80~200℃ |
-80~200℃ |
High temperature curing |
0.25hr.@ |
0.75hr.@ 100℃ |
0.5hr.@ 121℃ |
not suitable |
not suitable |
not suitable |
room temperature curing |
24hrs |
24hrs |
1wk** |
1wk** |
0.5hr |
0.5hr |
Usage period |
0.5hr |
1.0hr |
2.0hr |
0.5hr |
not suitable |
not suitable |
Storage period (months) |
9 |
9 |
6 |
6 |
6 |
6 |
Coverage |
1100 |
1000 |
1800 |
1300 |
not suitable |
not suitable |
Recommended thickness in (cm) |
0.001 |
0.001 |
0.008 |
0.10 |
0.0002 |
0.0002 |
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