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Silver copper powder (silver coated copper conductive powder)Sheet/spherical silver plated copper powderAs a new type of highly conductive material with performance comparable to traditional pure silver powder, it can be added to coatings (paints), adhesives (binders), inks, polymer slurries, plastics, rubber, etc. to make various conductive and electromagnetic shielding products, which are widely used in various industrial sectors such as electronics, electronics, communications, printing, aerospace, weapons, etc. Conductive and electromagnetic shielding of electronic, electrical, and communication products such as computers, mobile phones, electronic medical equipment, and electronic instruments.
Advanced Institute Technology has developed a silver coated copper powder product and its preparation technology with independent intellectual property rights based on market demand after years of research. The developed silver coated copper powder has good conductivity, low electrical resistivity, high dispersibility, and high stability, solving the oxidation resistance problem of copper powder and the high cost problem of pure silver, while ensuring good conductivity of the product, making it an ideal conductive powder. Silver coated copper powder can be widely used in conductive adhesives, conductive coatings, conductive rubber, conductive plastics, polymer slurries, conductive and electrostatic coatings, as well as various microelectronics technology fields that require conductivity and electrostatic conductivity, as well as industries such as electromagnetic shielding and surface metallization treatment of non-conductive substances. It is a new type of conductive composite powder.
The silver content of the silver coated copper powder produced by our company ranges from 5% to 80%. Customers can choose according to their own needs or order silver coated copper powder with any silver content.
At present, the company has built an industrial production line for silver coated copper powder, and the product has been widely used in East China, South China, North China, Southwest China and other regions. Its performance indicators have reached the level of similar foreign products.
Silver coated copper powder (silver plated copper powder) note: Note: Silver coated copper powder with different silver contents (such as 5%, 10%, 15%, 20%, 30%... 60%, etc.), various shapes (such as flakes, spheres, branches), and various particle sizes (325, 400, 600, 800 mesh, etc.) can be provided. 2. Product performance and characteristics: Silver coated copper powder is formed on the surface of ultrafine copper powder through advanced chemical plating technology, specific forming and surface treatment processes, to form silver coatings of different thicknesses. It not only overcomes the defect of easy oxidation of copper powder, but also solves the problem of expensive and easy migration of silver powder. It is a highly conductive filler with good conductivity, high chemical stability, low oxidation resistance, and low cost, and has great development prospects. Among them, the sheet-like F-type silver plated copper powder is suitable for conductive coatings, conductive inks, conductive adhesives, etc; Irregular spherical P-type silver plated copper powder has good dispersibility and is suitable for various high-temperature conductor sintering pastes, high-performance thick film silver based pastes, conductive rubber, conductive plastics and other conductive composite materials. 3. Application: Silver coated copper powder is a good high conductivity filler, which can be added to coatings (paints), adhesives (binders), inks, polymer slurries, plastics, rubber, etc., to make various conductive and electromagnetic shielding products. It is widely used in various industrial sectors such as electronics, electromechanical, communication, printing, aerospace, weapons, etc. Conductive and electromagnetic shielding of electronic, electrical, and communication products such as computers, mobile phones, electronic medical equipment, and electronic instruments.
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