Lead free silver conductor paste with adhesion to 96% alumina ceramic substrate

PC-Ag-8110Lead free silver conductor paste

technical data

Features: Lead free, cadmium free, high-temperature sintering, high conductivity, adhesion to 96% alumina ceramic substrate.

scope of application

Suitable for thick film hybrid integrated circuits, circuit leads and electrodes for separated components, internal connections and terminal leads for high-temperature fired circuits,Semiconductor ceramic device electrodesWait.

Technical indicators of pulp

product number

Solid content%

Viscosity Pa · s

Fineness µ m

PC-Ag-8110

79-82

500±100

<10

Usage process

Screen mesh/mask thickness: 325 mesh/25 µ m

Leveling time (LEVELING TIME): 5-10 minutes at 25 ℃

Drying conditions: 125 ℃/10-15 minutes

Firing Temperature: 850 ℃± 10 ℃

Time at Peak Package Temperature (TIME AT PEAK): 10-12 minutes

Rate of Heating/Cooling: 60-100 ℃/minutes

Total Cycle: 45-60 minutes

Substrate specification: 96% alumina

Thinner: Pineol

performance index

Product brand

Printing resolution

µm

sheet resistivity

mΩ/□

Sintering thickness

µm

solderability

220℃±5℃

Peel off adhesion

N/2×2mm

8110

125×125

5-15

7-15

excellent

>40

precautions

1. Safe use: If the slurry is accidentally swallowed, inhaled, or comes into contact with the skin, it is harmful. Therefore, it should be thoroughly cleaned immediately after use. Avoid contact with eyes, skin, or clothing, and do not approach fire or combustibles. Because it is flammable, it should be covered tightly when not in use to avoid inhaling volatile gases, and air circulation should be maintained during use.

2. This slurry is a ready to use product and does not need to be diluted. If dilution is required, the amount added should not exceed 3% (weight ratio). Excessive diluent will directly affect the performance of the slurry.

3. The thickness of the printed circuit itself cannot be less than 4 μ m, otherwise the conductivity will be unstable.

4. This slurry should be stored in a cool and dry place between 4-25 ℃.