Conductive performance 0.05 ohm cm single component glass filler silicone adhesive sealing silver adhesive

a kind ofGlass silver plated fillerSingle component conductive silicone adhesive. CHO-BOND 1035 can be used as a conductive filler and seal for electromagnetic shielding or grounding of electronic products. The recommended thickness for CHO-BOND 1035 is 0.007 inches (0.18 millimeters) CHO-BOND 1035Lightweight silver plated glass fillerProvided a low-cost electromagnetic shielding solution for various commercial and military applications that urgently need to reduce weight. The wet cured silicone rubber system of CHO-BOND 1035 allows for contact operation within 24 hours, providing a flexible, elastic conductive sealing environment and a wide range of temperature applications.

Glass silver plated filler

Good conductivity of 0.05 ohm cm

• Room temperature moisture curing

30 minute working life, rapid surface formation, 24-hour waiting time. No pressure is required during curing, with a wide range of application temperatures. It will solidify in one week.

• No corrosion to curing machinery

During the curing process, no substances that corrode the substrate are produced

• Moderate adhesion

Easy to operate, easy to use and apply. Can be used for ceilings or vertical surfaces

To achieve the desired bonding effect, CHO-BOND 1035 should be used in combination with CHOSHELD 1086. Typical applications include personal portable electronic devices, radar and communication systems, electromagnetic shielding exits, military ground vehicles, and shelters. However, due to its spherical silver plated glass filling material, CHO-BOND 1035 is not recommended for equipment and applications that require material vibration