Application of Copper Paste and Gold Paste in 5G Communication Electronic Products Printed Circuit Board (PCB)

With the development of 5G communication, electronic products are becoming smaller in size, and the volume of printed circuit boards (PCBs) is constantly shrinking, resulting in increasingly dense circuit designs. When the power density of the components increases, the heat dissipation of the PCB will be too large, which will affect the service life of the components, cause them to age or even fail.
At present, although the thermal conductivity of PCBs can be improved by directly burying or embedding metal copper blocks inside PCBs, thereby solving problems such as component aging caused by excessive heat dissipation, the flatness of copper blocks directly buried or embedded inside PCBs is poor. Copper paste with plug holes, this Sekong gold pasteIt has a specific thermal conductivity and viscosity, and can form high thermal conductivity, bubble free, and flat plug holes in printed circuit boards. It can obtain plug hole copper paste with specific thermal conductivity and viscosity, and the preparation method is simple, which can be widely used. Printed circuit board, which includes plug holes formed by the above-mentioned plug hole copper paste, has excellent thermal conductivity and a longer service life. The viscosity of the plug hole copper paste is 250-350dpa. s, and the thermal conductivity of the plug hole copper paste is 180-300w/m.k. Plug hole copper paste includes initial copper paste and Thermal Conductive AdhesiveThe viscosity of the copper paste is 70-110 dpa. s, and the initial thermal conductivity of the copper paste is 300-400 w/m.k.
         Copper paste with plug holesThe viscosity is 250-350dpa. s, and the thermal conductivity is 180-300w/m.k. Due to the specific viscosity and thermal conductivity of the plug hole copper paste mentioned above, it not only has excellent thermal conductivity, but also can solidify and form plug holes under small external forces. The formed plug holes will not produce problems such as bubbles, cracks, depressions, and voids.

With the increasing trend towards multifunctionality and miniaturization of electronic products, circuit boards such as printed circuit boards (PCBs) are also developing towards multilayering, layering, and high-density. This type of circuit board achieves electrical interconnection between layers through a large number of micropores. The traditional process involves depositing copper into the inner walls of micropores, then plugging the holes with ordinary non-conductive plug resin, and finally plating copper on the surface of the plug resin. This process is complex and not environmentally friendly (it contains processes such as copper deposition and plating, which generate a large amount of wastewater pollution and heavy metal pollution). Furthermore, some high-end electronic products (high-performance electronic products in the aviation industry) require the entire through-hole to conduct electricity, resulting in higher and more reliable final product quality. Therefore, traditional processes are no longer able to meet the future market demand for these high-end electronic products. For this reason, the market has already begun to useConductive plug hole pasteAfter plugging, the conductive plug paste solidifies to form a conductive electrical circuit, and the entire micropore has good conductivity, improving the quality of the final product.

At present, although there are some conductive pastes containing other conductive agents such as graphene and silver powder, these conductive pastes are all designed for printing conductive patterns on touch screens and achieving low-temperature curing characteristics to meet the needs of touch screen characteristics and production processes. However, it still has uneven dispersion and poor stability, resulting in unstable conductivity, poor high-temperature resistance, and easy cracking, making it unsuitable for use as a conductive plug hole paste in fields such as circuit boards.

At present, there is relatively little research on conductive plug hole paste used in circuit boards, and existing products mainly consist of two-component materials. However, the conductive plug hole slurry has a short storage period, is expensive, and has poor conductivity stability, high temperature resistance, heat resistance, poor flexibility, and is prone to cracking.