Low temperature co sintering (LTCC) filled silver paste is designed for use as an inner or ground layer, in conjunction with co fired ceramic green belts

Used as a second-class ceramic capacitor NTC、 Piezoelectric ceramic electrode. Can be burned and has good adhesion. Low temperature co sintering (LTCC) Silver paste for filling holesDesigned for use as an inner or ground layer, in conjunction with co fired ceramic green belts

Main performance indicators:

Product brand	Solid content%	*1 fineness μ m	*2 viscosity Pa · s
YB-Ag-5055	58 2	≤10	100~300
YB-Ag-5060	63 2	≤10	100~300
YB-Ag-5065	68 2	≤10	100~300
*When customers request special anti sticking requirements, the fineness can be relaxed to 15 μ m *2. Viscosity detection conditions, BROOK Field DV-52 # shaft, 25 ℃, 0.5r/min

Recommended usage conditions:

1. Mixing: Mix evenly before use.

2. Suggested printing thickness: 5-10 µ m.

3. Mesh material and mesh size: Polyester mesh, imperial 200-280 mesh.

4. Recommended drying conditions: After printing, place it in a 150-250 ℃ oven or drying tunnel for 2-5 minutes.

5. Recommended sintering process: sintering in tunnel furnace, peak sintering temperature of 830 20 ℃, peak insulation time of 10-15 minutes, sintering cycle of 45-60 minutes.

Performance indicators after firing:

1. Weldability: Excellent (welding conditions Sn/Pb/Ag or Sn/Pb 230 ℃, 1-2 seconds, immersion)

2. Adhesion (2X2mm2, vertical):> 40N

3. Square resistance: 2-4 m Ω/□

matters needing attention:

1. Safe use: If the slurry is accidentally swallowed, inhaled, or comes into contact with the skin, it is harmful. Therefore, it should be thoroughly washed with water immediately after use. Avoid contact with eyes, skin, or clothing, and do not get close to fire or combustibles. Because it is flammable, it should be covered tightly when not in use to avoid inhaling volatile gases, and air circulation should be maintained during use.

2. This slurry is a ready to use product and does not need to be diluted. If dilution is required, please use our company's specialized diluent. The amount added should not exceed 3% (weight ratio). Excessive diluent will directly affect the performance of the slurry.

3. The thickness of the printed circuit itself cannot be less than 4 μ m, otherwise the conductivity will be unstable.

4. This slurry should be stored in a cool and dry place between 4-25 ℃.

5. Storage period: The original packaging is sealed for six months.