LED display screen specific adhesive, crystal fixing adhesive, insulation adhesive

The main characteristics of our bottom filling material for flip chip are:

L can flow quickly in extremely small gaps, with no voids in the flow layer

Extremely low water absorption rate, able to pass JEDEC level 3 assessment after filling

Low thermal expansion coefficient, compatible with silicon wafers and substrates

Our CSP/BGA capillary flow bottom filling material has the following characteristics:

L can spray glue and quickly flow through very thin gaps at room temperature, with no voids in the flow layer;

L can cure quickly at low temperatures, with a long working life (room temperature service life>7 days), and can be stored for a long time at 2-8 ℃;

Good solder compatibility and good wetting properties with solder balls;

Easy to repair, the solder pads are easy to clean during repair

Can pass drop test and thermal cycle test;

Compliant with RohS and low halogen requirements