Special silver adhesive for chip bonding in microelectronic components and optical electronic products

It is a completely solid-state chip bonding application for microelectronic components and optical electronic productsSpecial silver adhesiveDue to its high thermal conductivity,
It is also used in the thermal conductivity industry, and years of use have proven its reliability. It is also the best thermal conductivity auxiliary material designated for use.
Advantages and Applications:
This product is highly recommended for use in the production line of fast curing chip bonding systems.
The Joint Electron Device Engineering Council (JEDEC) has recommended the use of plastic chip packaging in the production of second and third level standards
Suitable for thermal electric coupling extrusion welding from 300 ℃ to 400 ℃.
Very suitable for high-voltage components, high current components, and high current light-emitting diodes (LEDs).
Suitable for optical product packaging materials: light-emitting diodes, liquid crystal displays, and fiber optic chemical products.

Origin: China

Brand: Research Platinum

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