Can withstand high temperatures up to 150 degrees Celsius, with low viscosity and good fluidity. Sensor sealing AB adhesive

Sensor sealing AB adhesiveFor room temperature curing epoxy sealant, it can withstand high temperatures of up to 150 degrees, has low viscosity, good fluidity, and is easy to penetrate into the gaps of the product; Can be cured at room temperature or medium temperature, with moderate curing speed and long operating time; After curing, there are no bubbles, the surface is smooth, there is good gloss, and the hardness is high; The cured material has good acid and alkali resistance, excellent moisture, water, oil, and dust resistance, and is resistant to moisture, heat, and atmospheric aging;

Scope of application: Mainly used in transformers, high-voltage packages, rectifiers, filters, transformers, drivers, ignition coils, LED lighting fixtures, magnetic locks, etc; It mainly plays a role in sealing confidentiality, insulation protection, thermal conductivity and heat dissipation, and waterproof and moisture-proof.

Suitable for sensors, transformers, micro water pumps, electronic components, solar energy, backlight sources, electrical modules, block capacitor packaging, electronic modules, power circuit boards, reactor encapsulation, etc. Product features:

Durable and resistant to yellowing

Highly transparent and bubble free

Compliant with environmental certification

Adhesive bonding/sealing/approval

Application industry:

Used in industries such as automotive, electronics and electrical, 5G communication, photovoltaic energy, etc.

• The surface of the product to be sealed with AB glue using sensors needs to be kept dry and clean;
• Accurately take agent A and agent B in a weight ratio of 2:1, and mix them thoroughly to avoid incomplete curing;
• After stirring evenly, please pour the AB adhesive into the sensor in a timely manner and try to use up the mixed adhesive solution within the available time;
• During the curing process, please keep the product horizontally placed to prevent the sensor sealing AB adhesive from overflowing during the curing process.

Product precautions for safer use

• The AB adhesive for sensor encapsulation will gradually solidify after mixing, and its viscosity will gradually increase, releasing some heat;

• The more glue is mixed together, the faster the reaction and curing speed will be, and a large amount of heat may be released. Please pay attention to controlling the amount of glue mixed at once, because due to the accelerated reaction, the usable time will also be shortened. The mixed glue should be used up as soon as possible;
  

• Useful time: refers to the time after which the viscosity of 100g of mixed adhesive solution doubles under 25 ℃ conditions. After the non operable time, the adhesive solution must not be used;

• A very small number of people may experience mild skin allergies and itching when exposed to sensor encapsulation AB adhesive solution for a long time. It is recommended to wear protective gloves when using it. If it sticks to the skin, please wipe it off with alcohol and clean it with a cleaning agent;

• Before using in large quantities, please try the product in small quantities to master the usage skills and avoid errors