Tongjin paste is a series of electronic pastes designed for low-temperature co fired ceramic (LTCC) substrates

Through-hole gold pasteIt's low temperatureCo fired Ceramics (LTCC)An essential material in the series of electronic pastes for substrate matchingGold powderThere are high requirements. Preparation of gold powder using ascorbic acid reduction system, studying the effects of silver nitrate solution concentration, pH value, and reducing agent concentration on the morphology and particle size distribution of silver powder. Scanning electron microscopy was used to characterize and analyze the prepared gold powder, and three different types of silver powder were selected to prepareThrough-hole gold pasteConduct compatibility testing. The results indicate that spherical ultrafine gold powder with good uniformity, dispersibility, and an average particle size of 2.0 μ m has good potential for application