Using gold platinum palladium powder as the conductive phase
electronic pasteDue to its excellent weldability, solder resistance, and reliability, it has become one of the key electronic pastes used in low-temperature co firing processes Using two different characteristics
Gold platinum palladium alloy powderCorresponding slurries were prepared, and the compatibility, electrical properties, weldability and resistance, adhesion, and other properties of two slurries with Ferro A6 ceramic ribbon after co firing were compared and studied The results indicate that the slurry prepared from high-density, submicron sized spherical powder has better comprehensive performance
Gold pasteCommonly used for eutectic connection of silicon and germanium materials in semiconductor integrated circuit chips. Gold paste containing a small amount of palladium or platinum has reduced metallurgical activity and is used as a terminal material for thick film resistors. Conductors can be welded with lead tin solder.
Gold palladium slurryThe application of gold platinum paste in highly reliable electronic circuits, as a terminal material for resistors and a lower electrode for thick film capacitors, can ignore the diffusion and reaction between them during sintering.
Gold platinum slurrySpecially recommended for soldering discrete components with lead tin solder and frequently replacing components. Due to the high content of palladium or platinum, the square resistance value of the sintered conductor is also relatively high, about 80 and 90m Ω/port, respectively.
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