Gold conductor paste printed and fired on the co fired film layer

    Gold conductor pasteAs a precious metal slurry with high price, it is generally used for high-temperature co fired ceramics (HTCC) with special requirements Co firing slurryPost fired slurry for low-temperature co fired ceramics (ltcc) with extremely high conductivity requirements. In the existing conductive gold pastes used in HTCC, most of them are developed for co firing purposes. The surface platinum conduction band formed after firing cannot be soldered, and external leads cannot be drawn out from the platinum layer. In order to achieve a conductive platinum layer on the surface of high-temperature ceramic substrates, a small amount of glass is added to the platinum slurry to promote sintering matching between the slurry and the substrate, and to increase the sintering adhesion between the platinum layer and the substrate. However, as these slurries are currently only used for high-temperature co firing and do not take into account the welding performance of the platinum layer on the substrate surface after firing, therefore, these Conductive platinum pasteThe platinum layer formed after sintering cannot be soldered and can only be connected by pressure bonding.