A bonding alloy slurry for LTCC substrate surface matching with Fulu A6M raw material tape

Gold pasteCommonly used for eutectic connection of silicon and germanium materials in semiconductor integrated circuit chips. Gold paste containing a small amount of palladium or platinum has reduced metallurgical activity and is used as a terminal material for thick film resistors. Conductors can be welded with lead tin solder.Gold palladium slurryandGold platinum slurryApplied in highly reliable electronic circuits, as the terminal material for resistors and the lower electrode of thick film capacitors, the diffusion and reaction between them during sintering can be ignored. Gold platinum paste is particularly recommended for soldering lead tin solder for discrete components that are frequently replaced. Due to the high content of palladium or platinum, the square resistance value of the sintered conductor is also relatively high, about 80 and 90m Ω/port, respectively.