Used for producing high-purity gold powder (Au Powder) for pressing and bonding sputtering targets

Our high-purity gold powder has an average particle size range of -325 mesh, -100 mesh, 10-50 microns, and submicron (<1 micron), making it an innovative material used in many gold plating projects. For more details, please feel free to call us for more discounts!

High purity gold powderapplication

Used for producing pressed and bonded sputtering targets, as well as chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes, including thermal and electron beam process (electron beam) evaporation, low-temperature organic evaporation, atomic layer deposition (ALD), organic metal and chemical vapor deposition (MOCVD). The powder is also suitable for all applications that require a large surface area, such as water treatment, fuel cells, and solar energy applications.