A double-sided adhesive for bonding heat sinks and other power consuming semiconductors with aluminum foil thermal conductivity

YB-AT2002 Aluminum foil thermal conductive double-sided tape series is a type of tape used for bonding heat sinks and other power consuming semiconductors. These tapes have extremely strong adhesive strength and low thermal impedance, which can effectively replace thermal conductive silicone grease and mechanical fixation.

Very soft surface is relatively soft

● Good conductivity Good conductivity

Good thermal conductivity

Tear resistance&Punch resistance, tear resistance, and puncture resistance

Product Configuration:
Standard size: 0.15mm * 1000mm, 0.25mm * 1000mm


The Test Environment:
The measured data is at 65% relative humidity and 23 degree Celsius. The measured data is at a temperature of 23 ℃ and a relative humidity of 65%.


Shelf Life Shelf Life:
Within 6 months from the shipment date of my company.


Product Structure Profile Product Structure Analysis Diagram:

Thermal Grease Thermal Adhesive

Aluminum foil

Thermal Grease Thermal Adhesive

Release Paper

 

Property	YB-AT202		Unit	Test Method
Substrate Type	Aluminum foil		one	one
Substrate Thickness	0.15	0.1	mm	one
Substrate Color	Silvery White	Silvery White	Visual	Visual
Color of Bottom Paper	White (white)	White (white)	Visual	Visual
Thickness of Bottom Paper	0.125	0.13	W/M-K	one
Adhesive Thickness: Adhesive Thickness	0.1	0.15	one	one
Surface Adhesive Surface Adhesion	≧2	≧4	Kv/mm	one
Surface Adhesive Surface Adhesion	≧1.0	≧1.0	kg/in	PSTC-1
Adhesive Force	≧1.2	≧1.2	hg/ in	PSTC-1
Retention retention	48 ↑	48 ↑	hr	PSTC-1
Long term temperature resistance	90	90	℃	EN344
Short term Temperature	140	140	℃	EN344
Withstanding Voltage	＞4	＞4	K v/mm	ASTM D149
Thermal conductivity coefficient	≧1.5	≧1.5	W/M-K	ASTM D5470