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Company news

Low temperature short-term sintering of nano silver ink silver paste

Time:2022-05-07Number:1385

Low temperature silver pasteProduct advantages

  • High solid content can form thick films
  • Low specific resistance (can achieve low impedance of the route)
  • Diverse printing techniques provide users with rich choices
  • Products with three standard product codes can be purchased in small quantities for testing

 

Product Application

Classification of Platinum Research

project unit YB163 YB351 YB409
Recommended printing process - ink jet Glue printing screen print
Silver concentration wt % 50 63 67
Solvent composition - Carbon hydride/ethanol Non water soluble solvents Non water soluble solvent
Silver film thickness µm 0.2~1.0 5.0~ 1.0~5.0
Silver film width µm 50~ 250~ 50~
Line resistance value (120 ℃, 30min sintering) Ω 300 (line width 70 µ m, line length 10cm, maximum thickness 0.3 µ m) 2.5 (line width 300 µ m, line length 10cm, maximum thickness 10 µ m) 315 (line width 100 µ m, line length 10cm, maximum thickness 4 µ m)

Volume resistance 1) (120 ℃, 30min sintering)

µΩ・cm 7.0 4.2 6.2

1) OnlyOrdinary silver pasteAbout one tenth of it

Products outside the standard product number can be consulted separately, and the viscosity of the product can be adjusted according to customer needs.

The above data is for reference only and is not a specified numerical value

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