XJY-G1050 Silver Paste Ink Sheet Silver Package Copper Powder Product Technical Parameters

XJY-G1050Silver paste ink sheet silver foil copper powderIt is a high-performance conductive filling material from our company, with good oxidation resistance. Widely used for conducting and electromagnetic shielding in electronic, electrical, and communication products such as computers, mobile phones, electronic medical equipment, and electronic instruments.

Product attributes:

Silver content: 30%
Ag/cu≥(%)：99.8

Fe：0.02

pb：0.03

As:0.005

sb:0.01

0:0.13

Bi:0.002

Ni:0.003

Average particle size: 7-18 μ m/particle size distribution can be customized according to customer requirements

Loose density: 0.5~0.7

Vibration density: 0.9~1.3

Square resistance (20 μ M): ≤ 0.005

Specific surface area: 0.3m ²/g~0.5m ²/g