Low temperature sintering nano silver paste for printed circuits

Advanced Institute of Technology DevelopmentLow temperature sintering nano silver pasteComposed of nano silver particles and other components, it has low-temperature sintering properties and can be sintered to form printed circuits at low temperatures.

Especially suitable for printing organic substrates such as PET and PC films that cannot be sintered at high temperatures. The product has the following characteristics:

1 Product bysilver nanoparticlesOrganic polymer, composed of organic solvents;

By co firing in air (100 ℃ -170 ℃), low resistance sintered silver is formed, with a volume resistance as low as 4-5 * 10-6 ohms depending on the sintering temperature;

3. Circuit printing below 80UM can be achieved through screen printing;

Printed circuits have high bending durability: even after bending 100000 times with a bending radius of R=0.5mm, the resistance value remains unchanged. The bending durability varies greatly depending on the substrate

Room temperature curing, fast curing speed, preliminary curing time of about 3 hours;