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Hotline:0755-22277778
Tel：0755-22277778
Mobile：13826586185（Mr.Duan）
Fax：0755-22277776
E-mail：duanlian@xianjinyuan.cn
Product Introduction
A bonding agent is synthesized by mixing epoxy resin, additives, and solvents. The bonding agent is then coated onto PI using a high-precision coating machine, and the solvent is removed by an air flotation oven. After being pressed onto copper foil at a certain temperature and pressure, and then cured at high temperature, it becomes a single-sided FCCL product with adhesive; The double-sided FCCL product with adhesive is made by coating the other side of PI with adhesive and pressing a layer of copper foil to cure.
Adhesive single and double-sided products (electrolytic, rolled) have excellent heat resistance, chemical resistance, and electrical properties, which can meet the special requirements of different thicknesses, ultra-high peel strength, and ultra-low dimensional stability in the market. Does not contain halogens, with flame retardancy reaching UL94 V-0 level. Meets RoHS directive requirements and does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers, etc.
Product Application
Flexible copper-clad laminate (FCCL)It is the most important raw material for flexible printed circuit boards (FPC), with the characteristics of light, thin, and flexible. By etching the circuit, leaving the circuit pattern, it plays a role in conducting and transmitting signals. Terminal products are used in LED light strips, antenna boards, connecting cables, motor cables, electronic component connecting cables, and other circuit products with wider wire diameters.
product mix
detection
| project |
Testing items |
Product characteristics |
Testing basis |
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| appearance |
PI surface |
The appearance surface is flat, without indentation, bubbles, foreign objects, bumps, scratches, burrs, pinholes, wrinkles, or delamination; No blemishes, spots, discoloration, deformation, etc. |
YB Spec |
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| Copper foil surface |
The surface of the copper foil is smooth, with uniform luster and no oxidation or discoloration. |
YB Spec |
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| performance |
Volume resistivity |
≥1.0 * 1013Ω. Cm |
IPC-TM-650 2.5.17 |
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| Surface Resistivity |
≥1.0 * 1010Ω |
IPC-TM-650 2.5.17 |
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| peelstrength |
Room temperature: ≥ 0.8N/mm |
IPC-TM-650 2.4.9 |
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| After tinning: ≥ 0.6N/mm |
IPC-TM-650 2.4.9 |
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| Dimensional stability (etching) |
MD≤±0.15% |
IPC-TM-650 2.2.4 |
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| Dimensional stability (baking) |
TD ≤±0.15% |
IPC-TM-650 2.4.9 |
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| Resistant to ion migration |
≥1.0 * 107Ω |
EIA JESD22-A110-A |
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| curl |
≤20mm |
IPC-TM-650 2.4.9 |
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| Appearance after rapid compression |
Appearance without color difference, discoloration, blistering, etc |
YTH Spec |
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| Appearance after etching and baking |
PI surface shows no discoloration or blackening |
YTH Spec |
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| Solder heat resistance |
95% of the tin plating area, without delamination or blistering |
IPC-TM-650 2.4.13 |
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| Etchability |
No residual copper after etching |
IPC-TM-650 2.3.7.1 |
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| moisture absorption |
≤2.0% |
IPC-TM-650 2.6.2 |
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| dielectric constant |
≤4.0 |
IPC-TM-650 2.5.5.3 |
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| dissipation factor |
≤0.04 |
IPC-TM-650 2.5.5.3 |
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| Drug resistance |
HCl 2mol/L, Immerse for 10 minutes, with a peel strength decrease rate of ≤ 20% |
IPC-TM-650 2.3.2 |
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| NaOH 2mol/L, Immerse for 10 minutes, with a peel strength decrease rate of ≤ 20% |
IPC-TM-650 2.4.9 |
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| Isopropanol 2mol/L, immersion for 10 minutes, peel strength decrease rate ≤ 20% |
IPC-TM-650 2.4.9 |
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| secure |
Flame retardancy -94 (VTM-0) |
UL-94 |
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| Environmental RoHS |
Outsourcing |
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| SVHC |
Outsourcing |
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| halogen-free |
Outsourcing |
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