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Tel：0755-22277778
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E-mail：duanlian@xianjinyuan.cn
Product Introduction
A high viscosity polyimide acid solution is synthesized by mixing various monomers with solvents, and then coated on copper foil by a high-precision coating machine. After high-temperature imidization, it becomes a polyimide film (PI), which is then physically treated according to requirements to becomeNon adhesive single-sided FCCLProduct.
The product has excellent dimensional stability, heat resistance, chemical resistance, aging resistance, mechanical properties and electrical properties. Does not contain halogens, with flame retardancy reaching UL94 V-0 level. Meets RoHS directive requirements and does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers, etc.
Product Application
Flexible copper-clad laminate (FCCL)It is the most important raw material for flexible printed circuit boards (FPC), with the characteristics of light, thin, and flexible. By etching the circuit, leaving the circuit pattern, it plays a role in conducting and transmitting signals. Terminal products are applied in high-end electronic products such as computers, mobile phones, digital cameras, camcorders, tablet displays, instruments and meters, drones, automotive electronics, aerospace, etc.
product mix
detection
| project |
Testing content |
Product characteristics |
Testing basis |
| appearance |
PI surface |
The appearance surface is flat, without indentation, bubbles, foreign objects, bumps, scratches, burrs, pinholes, wrinkles, or delamination; No blemishes, spots, discoloration, deformation, etc. |
YB Spec |
| Copper foil surface |
The surface of the copper foil is smooth, with uniform luster and no oxidation or discoloration. |
YB Spec |
|
| performance |
Volume resistivity |
≥1.0 * 1015Ω. Cm |
IPC-TM-650 2.5.17 |
| Surface Resistivity |
≥1.0 * 1012Ω |
IPC-TM-650 2.5.17 |
|
| peelstrength |
≥0.5N/mm |
IPC-TM-650 2.4.9 |
|
| Dimensional stability (etching) |
MD≤±0.15% TD ≤±0.15% |
IPC-TM-650 2.2.4 |
|
| Dimensional stability (baking) |
MD≤±0.15% TD ≤±0.15% |
IPC-TM-650 2.4.9 |
|
| Flexible resistance |
≥ 100000 times |
IPC-TM-650 2.4.3.1 |
|
| solderability |
245℃/4s |
IPC-TM-650 2.4.13 |
|
| soldering resistance |
288 ℃/10s/3 times |
IPC-TM-650 2.4.13 |
|
| moisture absorption |
≤2.0% |
IPC-TM-650 2.6.2 |
|
| Etchability |
After etching, there is no residual copper, no broken wires, no film peeling, and the circuit is clear without residual copper |
IPC-TM-650 2.3.7.1 |
|
| chemical resistance |
PI has no corrosion, delamination, or foaming |
JIS C 6471 9.2 |
|
| Interlayer bonding force |
≥1.0N/mm |
IPC-TM-650 2.4.9 |
|
| dielectric constant |
≤4.0 |
IPC-TM-650 2.5.5.3 |
|
| dissipation factor |
≤0.04 |
IPC-TM-650 2.5.5.3 |
|
| secure |
Flame retardancy -94 (VTM-0) |
UL-94 |
|
| Environmental Protection Rohs |
Outsourcing |
||
| SVHC |
Outsourcing |
||
| halogen-free |
Outsourcing |
||
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