Low temperature pressureless sintered silver for third-generation semiconductor packaging

With Model 3 and BYD Han silver plating on the surface of aluminum heat sinks for IGBT silver sintering (STPAK packaged IGBT used in Tesla Model 3).

The mainstream market for mid to high end MOSFETs (Insulated Gate Field Effect Transistors) and IGBTs is basically monopolized by European, American, and Japanese companies. Our country's dependence on foreign IGBT products has reached 90%. The main foreign IGBT manufacturers include Infineon, ABB, Mitsubishi, Siemens, Toshiba, and Fuji. Toyota is currently the only global automaker capable of producing IGBT independently.

The suppliers of low-temperature silver sintering technology for mass production of IGBT in the domestic new energy vehicle field are CRRC Zhuzhou Times and BYD. The voltage of IGBT for new energy vehicles is generally 650V (passenger cars) and 1200V (commercial vehicles) levels. The above applications recommend the Advanced Institute Technology's pressureless sintering silver research platinum 600 series and pressure sintering silver research platinum 500 series.

twoLow temperature conductive silver adhesiveUsed for packaging various chips in new energy vehicles:

Chips have a wide range of applications in the automotive industry. In addition to common multimedia entertainment systems, smart keys, and automatic parking systems, chips are also widely used in automotive engine and transmission control systems, airbags, driving assistance systems, electric power steering ABS、 Electronic Stability Program (ESP), pedestrian protection, tire pressure control, power windows, lighting control, air conditioning system, and seat adjustment system are considered the nerves of automobiles. Recommend Advanced Institute Technology's chip packaging conductive adhesive AS6500; Low temperature chip packaging conductive adhesive AS6200; Ultra low temperature chip packaging results in silver adhesive AS6080.

Generally speaking, automobiles include subsystems such as power transmission, chassis, safety, information and entertainment, body, and network communication. With the development of intelligence, networking, and electrification, a large number of semiconductor components are increasingly being used in various subsystems of automobiles, such as analog devices MCU、 Memory, power devices, sensors, etc. Recommended Advanced Institute of TechnologyChip packaging conductive adhesiveResearch Platinum 6001 Series; Low temperature chip packaging conductive adhesive research platinum 6001 series; Ultra low temperature chip packaging resulted in silver adhesive 6002.

From the perspective of application fields, semiconductor chips in traditional automobiles are mainly used in power transmission systems, vehicle bodies, chassis&safety, and audio-visual entertainment systems, accounting for over 90% of the total. Among them, traditional power systems account for 46%.

In pure electric vehicles, power chips account for 55%, and we recommend the low-temperature pressureless sintered silver AS9375 and AS9330 from Advanced Institute Technology; MCU accounts for 11%, and we recommend Advanced Institute Technology's conductive adhesive Research Platinum 6500; Sensors account for 7%, and we recommend Advanced Institute Technology's Research Platinum 6089; Other chips account for 27%, and we recommend Advanced Institute TechnologyLow temperature conductive silver adhesive 6001.

Research Platinum 6006 is a stretchable silver conductor that can withstand thermoforming and overmolding temperatures, suitable for capacitive switch applications and interconnect circuits, and can achieve fully integrated three-dimensional functional electronic devices. Similarly, for In Mold Electronics, the advantages are higher conductivity of silver, less silver display on the graphic layer, direct adhesion to polycarbonate and graphic ink, and performance after thermoforming and injection molding.

Yanbo 6080 is a dispensing type conductive silver adhesive that quickly solidifies at 90 degrees and can withstand hot forming and super molding temperatures. This conductive adhesive can be used to connect various components on patterned conductive ink and/or glazed polycarbonate substrates.

Research Platinum 6082 is used to make electronic transparent electrodes in IME molds, which are transparent conductive ink products with resistance values ranging from 50-2000 ohms. Can be used for heating defogging, button touch, making transparent circuits, etc.

Research Platinum 6083 can directly produce RFID antennas.

6084, transparent protective ink, protects silver lines from oxidation, can withstand the temperature of thermoforming and overmolding plastics, has good stretchability, and can also serve as a bridge for silver lines.

6085, low-temperature rapid curing adhesive, can bond various plastics and difficult to bond metals.