A product developed for shielding circuits and cold light films, which can be widely used for low-temperature curing silver paste in flexible printed circuits

Typical applications

Low temperature curing silver pasteA product mainly developed for shielding circuits and cold light films, which can be widely used in flexible printed circuits.

General characteristics

Has good printability, conductivity, hardness, and extremely strong adhesion, compared toPure silver pasteIt has a significant cost advantage.

Performance Description

Instructions and guidance for use

Substrate: Substrate: Can be used on PET and PC sheets, especially suitable for PE substrates.

Mixing: thoroughly mix before use.

Dilution: After stirring evenly, this product can be used. Do not add diluents. If diluents are added, product quality and performance cannot be guaranteed. If there are special requirements, a matching diluent should be used. It is recommended to gradually add the diluent at a ratio of 0.5%, and the recommended amount of diluent should not exceed 2%.

Printing: This product can be used on both PET and PC sheets, and the thickness and resistance of the cured film are affected by many related factors, such as the size, tension, scraping hardness, angle and speed of the screen, and the thickness of the photosensitive paste.

Recommended curing process

Thickness: Dry film 4-6 μ m

Wire mesh: Use 150-250 mesh polyester wire mesh or stainless steel wire mesh

IR oven: 135 ℃ for 2 minutes

Oven: 135 ℃ for 30 minutes