High adhesion and conductivity, excellent plating resistance, conductive copper paste, sintered copper paste, copper paste

Conductive copper pasteThe main component of copper powder is copper powder, which acts as a conductive material inside. The copper powder is spherical or flake shaped with an average particle size of sub micron. The particle size of copper powder is a difficult problem in copper paste. When the particle size is too small, the number of contact points between copper powder particles increases, and the single contact area decreases, resulting in an increase in resistance. Moreover, the finer the copper powder, the easier it is to oxidize. When the oxidized copper powder reaches a certain degree, it will inevitably affect the conductivity of the copper paste. When the average particle size is large, the difficulty of printing will increase, and the operation will be very inconvenient

Conductive copper pasteSintered copper pasteCharacteristics of copper paste products

Lead free environmental protection; After sintering, the copper layer at the end is dense and bright; Good process adaptability and high coverage rate; After firing, it is tightly bonded to the ceramic body, with high adhesion and conductivity, excellent plating resistance, and immediate weldability of the encapsulated components.

TECHNICAL INDEX

Solid content (%): 78% ± 2

Viscosity (Kcps): 90 ± 20

Fineness ≤ 15

(Note: Viscosity testing conditions: Brookfield LVT, 4 #, 12rpm, 25 ± 0.5 ℃)

 Recommended process:

Mixing: Low speed rolling for 24 hours or manual 3D mixing for more than 10 minutes before use;

Coating: Suitable for various end coating or screen printing processes such as thick silicone sheets, JIG sheets, thin silicone sheets, etc;

Cleaning: anhydrous ethanol or turpentine;

Drying: Chain type hot air oven, hot air drying at 100 ℃ for 10 minutes;

Sintering: 780~880 ℃, hold for 10 minutes, O2<5PPM；

Storage: 18-25 ℃, stored for 3 months;

Packaging: Packaged in 500g/1000g/2000g plastic cans.