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Application of gold-plated PI film pad thermal conductive material wireless charging module in 5G products

Time：2022-04-07Number：1371

Gold plated PI film pad

Product introduction: It has two electroplating technologies: chemical plating and vacuum plating; 150 ℃ high temperature resistance; Halogen-free flame retardant, UL94-V0

Thermal conductive material

Product Introduction: 8 series of multi form thermal conductivity products, covering multiple application scenarios; Thermal conductivity coefficient of 1-10W/m. K

Wireless charging module

Product introduction: High BS (1.4T) nanocrystalline strip formula patent; Thickness<0.3mm; Charging efficiency>87%

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Application of gold-plated PI film pad thermal conductive material wireless charging module in 5G products