Can be used in product environments that require high heat resistance at 300 ° C
In environments below 300 ° C, the shrinkage rate is also less than 1%, and the product has almost no deformation,
Especially suitable for masking tapes or gaskets in SMT and other processes.
Suitable for Foldable products that require heat resistance
When folding products, there are no worries like in Film
Directly apply heat-resistant adhesive
Non woven fabricOn top, heat-resistant tape can be used, especially on curves
The effect when using the part.
Due to its low heritability (2.7), it can be used for 3GHz in the future, 5GHZ, On a 28GHz 5G bandwidth.
It can be used in the same area as F-PCB for fast transmission without loss of information.
Strong chemical resistance, not easily contaminated by other substances, and will not oxidize
It is an absorbent product that will not affect electrical performance even if it is used for a long time.
LCP fibers themselves have strong tensile strength and are produced using the Melt Blow method,
Compared to products from other companies, the tensile strength is quite high
Non woven fabric manufacturing does not use adhesives, and the electrical performance of non-woven fabric after gold plating is very good
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