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Thermal conductive absorbing materialAs a new type of multifunctional electromagnetic protection material, after more than ten years of unremitting efforts, gratifying results have been achieved and industrialized production has been realized. Currently, the research on thermal conductive absorbing materials has received high attention in China. Based on the achievements made, the following aspects of research should be reopened in this field in the future.
Due to the current lack of functional unit models and corresponding component design methods that can guide the production of thermal conductive absorbing materials, mature single functional powder fillers can be selected as the basis for establishing functional unit models of composite powders/polymer matrices in the mechanism of thermal conductive absorbing materials in the future. Revealing based on“Functional powder/polymer matrix”Research on the influence of powder distribution on interfacial thermal conductivity performance through the construction mechanism of high thermal conductivity network chain structure. At the same time, based on the electromagnetic wave absorption principle of absorbers, the dielectric constant and magnetic permeability of the material are extracted, and the influence of the high thermal conductivity network chain structure inside the material on the electromagnetic wave response is analyzed. The collaborative design of the thermal conductivity network chain distribution parameters and the microstructure of the absorber is carried out, and the internal thermal conductivity network chain distribution parameters of the material and the matching absorber composition and microstructure are comprehensively adjusted to achieve synchronous improvement of thermal conductivity and absorption performance.
Given the significant differences in evaluation indicators, testing principles, testing methods, and testing standards for thermal absorbing materials, future scientific research and production units in the industry will discuss and introduce unified standards for performance testing methods and requirements for thermal absorbing materials, establish a complete standard evaluation system, and provide necessary technical specifications and guidance for the development, production, and performance evaluation standards of products in this field. This will further promote the development of technology and products in this field, fully leveraging the guiding role of "standard first" and promoting the development of technology in this field.
In order to meet the performance requirements of high-precision electronic devices for thermal conductivity and absorption materials, chain like polymer materials (silicone rubber) are used as the application object to develop powder fillers that truly combine thermal conductivity and absorption functions, breaking through the upper limit of the original performance indicators and fundamentally solving the bottleneck problem that currently restricts the performance improvement of thermal conductivity and absorption materials. The current hot topic in the field of new materials research is graphene, which is a single-layer carbon atomic crystal with two-dimensional sp2 bond hybridization. Its low dimensional structure can significantly reduce the boundary scattering of phonons at grain boundaries, and it has a unique two-dimensional periodic honeycomb lattice structure. The stable carbon hexagonal rings present in the structural units endow it with excellent thermal performance, making it an excellent thermal conductive material. In addition, by surface modification of graphene powder (introducing magnetic powder particles such as barium ferrite, nickel zinc ferrite, etc.), and then adding it to the substrate material to improve the overall impedance matching characteristics of the material and enhance the electromagnetic wave absorption performance, it is expected to develop new types of materialsGraphene thermal conductive absorbing materialThis will also become an important research direction in the field of thermal conductive absorbing materials for a considerable period of time in the future.
With the advancement of relevant simulation technologies and the improvement of the preparation level of artificial materials, intelligent materials, and thin-film absorbing materials, the design methods and means of new materials are becoming increasingly mature, realizing active design of material electromagnetic parameters, breaking through the limitations of traditional materials on electromagnetic properties, and providing new degrees of freedom for material performance design and preparation. Based on this technology, heat transfer requirements are determined through material composition decomposition, and efficient absorption of electromagnetic waves is achieved through structural design. This direction combines the latest research achievements in the fields of electromagnetic fields and microwaves, materials science, micro nano processing, etc. It has strong interdisciplinary nature and broad future application prospects, and has gradually attracted the attention of the academic community at home and abroad. It will become a new research hotspot in the field of thermal conductive absorbing materials.
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