Advanced Institute Technology adopts electroplating and intermediate frequency-
DC magnetron sputtering technologyPrepare silver coatings on the surface of Inconel 718 nickel based high-temperature alloy substrate Use Vickers microhardness tester and micro nano scratch tester to measure the hardness and adhesion of two types of coatings at room temperature, after annealing at the operating temperature, and after annealing at the ultimate temperature; Using SEM and EDS to observe the microstructure and elemental composition changes of the tested coating after different insulation treatments The results showed that the microhardness of PET magnetron sputtered silver coating at room temperature of 25 ℃ was 139.7 HV, which was 45.5% higher than that of electroplated silver coating; The adhesion is 40 N, which is three times that of electroplating method After insulation treatment, due to the smaller average size and more uniform distribution of individual grains in the PI silver coating produced by intermediate frequency direct current magnetron sputtering method, the oxidation at the interface between the coating and the substrate is better suppressed Compared with traditional silver electroplating coatings, the hardness and adhesion of PI magnetron sputtered silver coatings at 400 ℃ are significantly improved; But the advantage is relatively small at 650 ℃, and both coatings peel off after 24 hours
We have accumulated surface treatment technology for electroplating metal powder on flexible insulation materials, such as our current production line and laboratory level trial production. At present, the following materials can be electroplated
| Compatible materials |
Plate thickness (mm) |
Board width (mm) |
Compatible electroplating specifications |
| SUS type |
0.03 |
100 |
Nickel plating, tin plating |
| Cu alloy system |
0.04 |
100 |
Nickel plating, tin plating |
*We can respond to requirements beyond the above specifications at the laboratory level.
To address further issues
In response to various customer requirements, we are making the following attempts.
Perform electroplating treatment with thinner and wider plate thickness
In various fields, in order to reduce the height during use and improve production efficiency, there has been a demand for electroplating treatment on thinner and wider board widths. Jinhualong Electronics is considering introducing equipment and technology to respond to customer requirements.
For the requirements of increasing surface area and improving adhesion with other materials, we have received various applications, such as power storage devices, but especially many.
① I want to increase the surface area.
② I want to improve the adhesion of the material surface.
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