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⑴ Can be used in product environments that require high heat resistance at 300 ° C
In environments below 300 ° C, the shrinkage rate is also less than 1%, and the product has almost no deformation, making it particularly suitable for masking tapes or gaskets in SMT and other processes.
⑵ Suitable for Foldable products that require heat resistance
When folding products, there are no worries like in Film
⑶ Apply heat-resistant adhesive directly onto non-woven fabric, using heat-resistant tape, especially when used in curved areas for the best effect.
Due to its low heritability (2.7), it can be used in 5G bandwidth of 3GHz, 5GHz, and 28GHz in the future. It can be used in the same area as F-PCB for fast transmission without loss of information.
⑸ Strong chemical resistance, not easily contaminated by other substances, and will not oxidize
⑹ It is an absorbent product that will not affect electrical performance even if it is used for a long time.
LCP non-woven fabric fibers themselves have strong tensile strength and are produced by Melt Blown method. Compared with products from other companies, their tensile strength is quite high Non woven fabric manufacturing does not use adhesives, and its electrical performance is excellent after gold plating
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