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Research history and latest progress of thermal conductive absorbing materials

Time：2022-03-05Number：1534

With the increase of power density in electronic devices, the electromagnetic compatibility and heat dissipation problems of electronic devices are becoming increasingly serious, and they have dual functional characteristics Thermal conductive absorbing materialBecoming a new trend in solving this problem. At present, the main research and development approach for this type of material is to simultaneously incorporate it into the polymer matrix thermal conducting fillersTo achieve the dual function of thermal conductivity and absorption of materials with absorbing agents. However, there is a maximum limit to the amount of functional fillers added in polymer materials such as rubber, and there is a trade-off between the amount of thermal conductive fillers and absorbing agents added, making it difficult to achieve a synergistic improvement of the two properties. At present, there is no effective way to solve this problem, and the optimal balance point of material thermal conductivity and absorption performance can only be determined by coordinating the addition ratio of two functional fillers.

Given that there are many factors that affect the thermal conductivity and absorption performance of materials, and these factors interact with each other, scholars in this field have studied the relationship between filler components, comprehensively analyzed the influence of factors such as particle size, structural parameters, and molding process parameters on material properties, and finally obtained a component adjustment mechanism and method with high guiding value for practical applications. After more than a decade of development, the preparation technology of thermal conductive absorbing materials has made significant progress, but there are still some technical bottlenecks that have not been overcome, which restrict the development of the entire industry. For example, the lack of material microstructure and functional unit models, the inability of universal design theories to guide actual industrial production, and the absence of single component fillers that combine thermal conductivity and absorption functions have seriously constrained the development of basic design theories for thermal conductive and absorbing materials. In the industrial production process of thermal conductive absorbing materials, there are many types of testing standards for material thermal conductivity, and the test results are not comparable. However, there are currently two evaluation methods for absorbing performance, which have significant differences in evaluation indicators, testing principles, testing methods, and testing standards, and the test results cannot be compared horizontally. In summary, there is currently a lack of unified and standardized standards for the performance evaluation of thermal conductive absorbing materials, which seriously restricts the promotion and application of products. At the same time, the main functional indicators of thermal conductive absorbing materials need to be further improved to meet the needs of practical use.

This article reviews the research history and latest progress of thermal conductive absorbing materials, analyzes the problems that need to be solved in the research of thermal conductive absorbing materials, and looks forward to their future research hotspots and technological development directions. The aim is to provide reference for the preparation of high-performance thermal conductive absorbing materials, improve industry technology level, and enhance product performance.
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Research history and latest progress of thermal conductive absorbing materials