The importance of silicone thermal conductive gasket, thermal conductive potting adhesive, single component silicone thermal conductive silicone tape for 5G smartphones and AR/VR devices

With the improvement of the performance and functionality of electronic devices, the heat generated by each device increases, and it is important to effectively dissipate, dissipate, and cool the heat. For high-performance mobile products such as 5G smartphones and AR/VR devices, the installation space of heat dissipation components is limited due to the use of high-performance ICs and highly integrated designs that pursue weight reductionThermal padandThermal conductive gelWait for TIM material to better dissipate heat.

Introduction and Application of Thermal Conductive Gaskets

Thermal pads are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics make them suitable for covering very uneven surfaces. Heat is conducted from the separation device or the entire PCB to the metal casing or diffusion board, thereby improving the efficiency and service life of the heat generating electronic components.

In the use of gaskets, pressure and temperature are mutually constrained. As the temperature increases, after a period of equipment operation, the gasket material undergoes softening, creep, and stress relaxation, and the mechanical strength also decreases, resulting in a decrease in sealing pressure.

In the use of gaskets, pressure and temperature are mutually constrained. As the temperature increases, after a period of equipment operation, the gasket material undergoes softening, creep, and stress relaxation, and the mechanical strength also decreases, resulting in a decrease in sealing pressure. vice versa. For example, the manual lists the use of high-pressure asbestos rubber sheet XB450 in water and steam media at a temperature of 450 ℃ and a pressure of<6MPa (when conducting sealing performance tests on this material, it is kept under pressure for 30 minutes in steam at 440 ℃~450 ℃ and 12MPa). However, in long-term practical use, if the temperature reaches 450 ℃, the pressure that can be sealed is only 0.3~0.4MPa. For gas media with strong permeability, it is only 0.1~0.2 MPa.

General characteristics of organic silicon thermal conductive gaskets:

(1) Has good elasticity and resilience, able to adapt to pressure changes and temperature fluctuations;

(2) Has appropriate flexibility and can fit well with the contact surface;

(3) Non polluting process media;

(4) Has sufficient toughness to prevent damage caused by pressure and fastening force;

(5) Not hardening at low temperatures, with small shrinkage;

(6) Good processing performance, easy installation and compression;

(7) Non adhesive sealing surface, easy to disassemble;

(8) Competitive cost and long service life.

1、 Intelligent security monitoring products

Security system belongs to the category of the electronics industry, which comprehensively utilizes modern computer technology, integrated circuit application technology, network control and transmission technology, and software technology. Security products can be roughly divided into three categories: video surveillance, access control, and anti-theft alarm. The transformation from "visible" to "clearly visible", and now to intelligence, the initiative of the security industry continues to increase, and edge perception intelligence has gradually become the new goal of the intelligent security industry. The era of highly intelligent comprehensive security has arrived.

Intelligent security has put forward higher requirements for image transmission speed, clarity, video storage duration, and data analysis. This combination not only increases the cost of video surveillance storage solutions, but also increases the heat flux density and heat generation of its circuit system, which puts enormous pressure on the manageability of the overall intelligent security solution. As is well known, the working temperature of electronic devices directly determines their service life and stability, and heat dissipation has become an important indicator for measuring product performance in the electronics industry, especially for monitoring camera heat dissipation. In practical applications, if poor heat dissipation leads to excessive temperature of the core chip, it can easily cause a series of thermal faults such as blurry monitoring images, packet loss, bit errors, and restarts.

Cameras are gradually moving towards high-end image quality such as 1080P, 4K, and 8K, with high-definition pixels approaching. Advanced technologies such as high-definition image processing and big data computing have made thermal management and EMI shielding issues increasingly prominent. The high power consumption and heat generation in a sealed environment require higher requirements for the overall heat dissipation scheme. The volatilization of thermal conductive material molecules, the precipitation of silicone oil, and the phenomenon of silicon migration have important impacts on optical lenses; The low temperature resistance of chips has become a bottleneck for heat dissipation, and reducing interface thermal resistance is an important factor to consider in thermal design.

To ensure stable and reliable operation of the camera, it is urgent to reduce the thermal load of core components and alleviate the phenomenon of thermal stress concentration on the circuit board. Nuofeng Electronics' high-performance interface materials such as low volatility, high thermal conductivity, low oil permeability, and ultra softness（Thermal grease, thermal silicone sheet, thermal tapeThrough high-temperature aging testing, we provide professional thermal management solutions for the security industry, ensuring the safety and long-term reliability of security products during normal operation.

2、 Smartphone products

The frequency of smartphone chips is getting higher and higher, which generates a large amount of heat. Excessive heat can affect user comfort and may also burn out hardware. Therefore, major manufacturers will consider how to dissipate heat from smartphones.

After entering 2019, driven by the urgent demand in the future, mobile phone cooling has once again become a new hot spot in the market. Xiaomi's flagship gaming phone, the Black Shark, is equipped with a multi-level direct touch integrated heat and cooling system. Its main heat dissipation part is copper sheet, with only a very small amount of built-in liquid in the middle slender part; There is also the Honor Note10, which adopts The Nine heat and cooling technology, adding a liquid cooling heat dissipation layer on the basis of the original eight layer heat dissipation, and using graphite paste thermal conductivity and heat pipes; In addition, the Meizu 16 also adopts water-cooled heat dissipation and has been coated on the surface of the processorTHERMAL GREASEFurther enhance the thermal conductivity function!

With the advent of the 5G era, mobile phone heat dissipation has become a hot topic in the industry. In the situation where the battery capacity of smartphones cannot be significantly increased, in addition to developing solutions to reduce energy consumption, the importance of heat dissipation for smartphones is further highlighted. In addition, the current glass back cover will become the mainstream in the market, and its heat dissipation performance is inferior to that of metal back covers. This is also an important reason why many glass back cover phones use graphite sheets attached to the glass back cover! According to market news, Huawei 5G phones are expected to use 0.4mm copper sheets and fill gaps with thermal conductive silicone grease as the core heat dissipation components of the phone!

5G mobile phone antennas and RF front-end will undergo significant changes, and high-frequency mobile phone antennas are expected to adopt active methods. The power consumption of mobile phones will increase significantly, and heat dissipation technology solutions will be crucial. In addition to traditional graphite heat dissipation and liquid cooling tube heat dissipation technologies, there will also be the emergence of heat dissipation technologies in the future, including some new heat dissipation materials that will also be applied in smartphones.

With the increasing application of heat dissipation components in mobile phones and PCs, many enterprises have already laid out the field of heat dissipation components and materials. With the arrival of the 5G Internet of Things era, the level of intelligence of future smartphones and people's dependence on smartphones will be incomparable. As a direction of smartphone research and development, the application of heat dissipation technology in smartphones will become increasingly important. The heat dissipation demand of the mobile phone industry will also drive changes in heat dissipation materials and research on new technologies. More and more enterprises will layout or upgrade their industries in this field.

3、 Power adapter products

A power adapter is a power conversion device for small portable electronic devices and electronic appliances, widely used in devices such as telephone mother and child machines, game consoles, language repeaters, portable players, laptops, cellular phones, etc. A power adapter is generally composed of a housing, a power transformer, and a rectifier circuit. It can be divided into AC output type and DC output type according to its output type; According to the connection method, it can be divided into wall mounted and desktop mounted. Power adapters are widely used in various fields such as industrial automation control, military equipment, scientific research equipment, LED lighting, industrial control equipment, communication equipment, power equipment, instruments and meters.

Due to the use of a large number of high-power semiconductor devices in power adapters, such as rectifier bridge stacks, high current rectifiers, high-power transistors, or field-effect transistors, they generate a large amount of heat during operation. Once the power supply temperature exceeds 75 ℃, if this heat cannot be discharged in a timely manner and kept at a reasonable level, it will affect the normal operation of the power adapter, and in severe cases, it may even damage the power adapter. Usually, power adapter manufacturers use some thermal insulation materials to help the power supply dissipate heat during design and production. So, what are the commonly used thermal insulation materials for power adapter heat dissipation solutions?

Thermal conductive sealing adhesive

Thermal conductive adhesive sealing is divided into sub branch sealing and overall sealing. The interior of the power adapter is uneven and irregular, requiring a thermal conductive material that can completely wrap the transformer and cannot be moved freely. Local sealing is generally concentrated in situations where the heat generation is high and cannot be replaced by other thermal conductive materials. Integrated encapsulation is used for outdoor power supplies because some of them need to work outdoors for a long time. In addition to solving the heat dissipation problem, the waterproof and sealing properties of the power supply also need to be considered. Therefore, outdoor power supplies basically use integrated encapsulation for heat dissipation.

Thermal conductive silicone sheet

For the power supply industry, the application proportion of thermal conductive silicon film is usually small, but sometimes it is essential. Generally, the application of thermal conductive silicon film in power adapters is mainly concentrated on PCB boards. A special application and demand will inevitably have a special supply to meet it. Thermal conductive silicon film is applied on PCB boards and has multiple functions such as high thermal conductivity efficiency, electrical insulation, shock resistance, and puncture resistance, which can effectively solve safety problems for clients.

Single component silicone gel

Single component silicone is commonly used for local thermal conductivity of power components, while also serving as a fixing element. It has good adhesion and sealing properties for both metal and non-metal materials.

Thermal conductive silicone tape

Usually used in power MOS tube packaging, standard components such as TO-220 and TO-3P are coated with a layer of silicone grease on the silicon film and MOS tube to increase adhesion and reduce thermal resistance.

Alumina ceramics

Whether in terms of thermal conductivity, temperature resistance, or insulation performance, it far exceeds that of thermal conductive silicone tape and can be used to replace silicone in the position of MOS tubes. For TO-220 and TO-3P series, there are standard parts that need to be coated with silicone grease to increase the contact area with MOS tubes.

4、 Wireless charger products

Wireless charging technology breaks the traditional connection line charging and is a wireless charging technology that utilizes intelligent power transmission to improve charging efficiency and convenience; In recent years, wireless charging for mobile phones has been widely recognized and its usage rate has been increasing, becoming a popular product in the mobile phone charging industry.

Wireless charging works through the principle of electromagnetic induction, and since it is a magnetic field cutting method, it will inevitably generate heat. Due to its small size, the working temperature of internal electronic components is the primary issue that needs to be addressed in wireless charging. Heat not only affects the efficiency of the wireless charger, but also conducts heat to the phone. In order to better dissipate heat, it is necessary to use metal materials instead of plastic materials for the wireless charging case, and the thermal conductive silicone gasket precisely provides its heat dissipation solution, solving this problem.

In order to improve the heat dissipation efficiency, the bottom of the wireless charger is usually made of a one-piece metal material with a thermal conductive silicone shock-absorbing pad. This can lay a good foundation for the heat dissipation of internal electronic components and also have the effect of anti slip, shockproof and not easy to wear.

In the internal coil of the wireless charger, this section includes the middle part where heat is concentrated. So a temperature main probe will be installed in the middle of the coil to ensure that the charger's operating temperature is within the safe temperature range.

By removing the screws on the metal substrate of the coil, the internal structure of the product's bottom shell can be seen. The bottom shell is made of metal integrated molding, which is also the key to heat dissipation. The use of metal is to better conduct the heat inside the product to the outside through the bottom shell, so that the internal working temperature can always be maintained in a safe state, thereby delaying the product's service life.

Due to the wireless charging circuit board connected to the bottom shell, all components are concentrated on one side of this PCB, and the circuit board is an irregular whole, so it cannot be seamlessly connected directly to the bottom shell. Therefore, a thermal conductive silicone gasket and conductive foam are attached to the bottom shell to fill the gap between the bottom shell and the circuit board, so that the heat of the circuit board is guided to the bottom shell through the thermal conductive silicone gasket and conductive foam to dissipate heat, and can also play an electromagnetic shielding role.

5、 Router products

A router is mainly composed of storage, power supply, transmission medium (i.e. cable) CSU/DSU、 Supplier's media CPU、 Composed of interfaces, modules, and other components. With the increase of working frequency and intensity, and in order to save costs and space, router manufacturers are producing smaller and smaller routers. In this case, heat dissipation has become the most headache for engineers. In order to solve the problems of heat dissipation and stability of routers, engineers usually use thermal conductive silicone film combined with the outer shell for heat dissipation in router thermal design.

Adopting a thermal conductivity coefficient of 2.0W/mk; The Shore C test hardness reaches 35 degrees; High temperature resistance, stable operation in an environment of -40~200 ℃, good insulation and compressibility; The thermal conductive silicon film solution that meets environmental requirements can meet the product usage needs of customers.

6、 Network set-top box products

A digital video conversion box, commonly known as a set-top box or set-top box, is a device that connects a television to an external signal source. It can convert compressed digital signals into television content and display it on the television. The signal can come from wired cables, satellite antennas, broadband networks, and terrestrial broadcasting. The content received by set-top boxes is not only the images and sounds that analog televisions can provide, but also the ability to receive digital content, including electronic program guides, internet pages, subtitles, and so on. Enabling users to watch digital TV programs on existing televisions and engage in interactive digital entertainment, education, and commercialization activities through the internet. With people's living standards improving and their lives becoming more diverse, network TV set-top boxes are emerging products of this era that are convenient, fashionable, trendy, and future oriented.

At present, the quality of set-top boxes on the market varies greatly. Most of them have simple structures and are more prone to generating a large amount of heat inside the set-top box during summer use. The large amount of heat generated by set-top boxes during use can affect daily use, leading to unstable video signals and even burning the set-top box, causing safety hazards at home. In addition, dust is easily accumulated at the fan of general set-top boxes.

In the internal structure of the set-top box, a signal output interface is provided on the outer wall of the set-top box, and a power interface is provided on the outer wall of the set-top box. One end of the power interface is fixedly connected to a first wire, and the first wire is connected in series with a second wire. One end of the second wire is connected to a fan brake motor. On the right side of the set-top box, there is a box body. The top of the box body is provided with a thermal conductive cover, and the top of the thermal conductive cover is fixedly connected to a thermal conductive copper tube. One side of the box body is fixedly connected to a first water tank. One side of the first water tank is fixedly connected to a switch. One side of the first water tank is fixedly connected to a nozzle, and the other side of the box body is connected to a second water tank. Both sides of the thermal conductive copper tube are fixedly connected to fins. The bottom surface of the set-top box is equipped with a second movable button, One end of the set-top box is fixedly connected to an antenna.

At the same time, the set-top box is equipped with three fans, and the fans are evenly arranged on the heat-conducting copper tube with the center of the right side of the heat-conducting copper tube as the axis of symmetry. The bottom of the box is fixed on the set-top box, and there are baffles around the box. The diameter of the thermal cover is three to five centimeters, and a fan is fixedly connected to the bottom of the thermal cover. The nozzle is set at the center of the top of the fan, and fine pores are evenly distributed on the nozzle.

If using set-top boxes in areas with high temperatures year-round, relying solely on fans for heat dissipation is not enough. Therefore, many network set-top box manufacturers have modified the fans installed inside the set-top box, including heat dissipation methods, thermal conductivity materials, etc., to fundamentally solve the problem of the set-top box being unable to work continuously.

Thermal conductive silicone sheetSoft, thermally conductive and insulated, especially with good compressibility and thickness that can adapt to different spatial ranges of set-top boxes, it has good controllability. Generally speaking, if the thermal energy generated by household appliances such as induction cookers, rice cookers, set-top boxes, microwave ovens, etc. during normal operation cannot be exported in a timely manner, it will cause the junction temperature of the appliances to be too high, thereby affecting the product's lifecycle, efficiency, and stability. The relationship between junction temperature, operating efficiency, and lifespan of appliances is also important. The set-top box transfers the heat from the chip to the housing through a thermal conductive silicone sheet, and uses natural convection to dissipate heat, so there is no need to worry about the set-top box burning out due to the housing being too hot.

Using a soft thermal conductive silicone sheet between the main IC or high-temperature components of the set-top box and the heat sink or the outer shell of the set-top box can reduce the temperature by about 18 degrees.

Thermal conductive silicone film is used to fill the air gap between heating devices and heat sinks or metal bases. The flexible and elastic characteristics of thermal conductive silicone film make it suitable for covering very uneven surfaces. Heat is conducted from the separation device or the entire PCB to the metal casing or diffusion board, thereby improving the efficiency and service life of the heat generating electronic components. The application of thermal conductive silicone sheets on set-top boxes enables faster heat dissipation and longer product lifespan.

7、 Driving recorder products

High temperature is the enemy of integrated circuits, which not only leads to unstable device operation and shortened service life, but also causes device components to burn out. If it is a portable electronic device, it can also cause harm to the human body. The heat that causes high temperatures comes from inside electronic devices, or in other words, from inside integrated circuits. The function of heat dissipation components is to absorb and dissipate this heat into or outside the device, ensuring the normal temperature of electronic components.

Faced with the complex traffic conditions and the inability of experts in collision prevention, 4G driving recorders have become an intelligent product for car owners to record driving videos. Especially now, many recorders are equipped with 1080P ultra-high definition video recording. During operation, the driving recorder continuously records videos, and the amount of data processed by the main components is very large. The chip is in high-speed operation, and the heat generated is also very large. If the critical components are not cooled, the recorder will stop recording, restart, and even burn out.

Especially many driving recorders are hung on the front windshield and exposed to sunlight, which can cause them to "die" after a long time. As soon as they are turned on, they heat up and crash. What should I do if the driving recorder heats up and freezes? Then it is necessary to solve the problem of heat dissipation in the product design scheme, and the application of thermal conductive silicon film is currently the mainstream solution. You may think that if I buy a sun resistant and high-temperature resistant driving recorder, there will be no problem. The key is to prescribe the right medicine. The most fundamental thing is to start with the internal heat dissipation structure of the driving recorder and choose a suitable thermal conductive silicone sheet to solve the problem of heat dissipation.

The main function of thermal conductive silicon film is to conduct heat to the main components for cooling, and to dissipate heat to ensure the normal operation of 4G driving recorders. The cooling principle of thermal conductive silicon film is to conduct the heat of the DSP main control chip and DDR2 chip of the driving recorder to the shielding cover, and then radiate the heat to the air and conduct it to the ground layer of the motherboard for heat dissipation through the shielding cover.

8、 Drone products

With the rapid development of technology, the market has increasingly high requirements for the performance of drones, such as image transmission speed and clarity. However, due to the need for drones to be as compact as possible, the design difficulty of their overall equipment's heat dissipation materials has become greater.

The two core components of drones are motors and electronic speed controllers. Drones rely entirely on propellers or turbofans for traction and propulsion during flight. The power that drives them to rotate comes from electric motors, but the speed and power of the motors are controlled by electronic tuning. Therefore, the smooth flight of drones cannot be achieved without the contribution of electronic tuning. If the motor's electrical control overheats and causes performance degradation, the electrical control cannot effectively control the motor speed, and the flight controller cannot withstand such a large current. Therefore, solving the heat dissipation problem of drones is of utmost importance.

In the heat dissipation structure of unmanned aerial vehicles, it includes connection blocks, mounting plates, heat dissipation plates, heat dissipation pipes, and heat dissipation ports; There are heat dissipation pipes installed on both sides of the top of the heat dissipation plate, and heat dissipation ports are installed inside the heat dissipation plate. There are connection blocks installed on both sides of the heat dissipation plate, and installation plates are installed on both sides of the connection blocks. The heat dissipation plate includes a heat dissipation bottom plate, heat dissipation fins, air inlet, and air outlet. There are heat dissipation fins on both sides of the heat dissipation bottom plate. The left side of the front end of the heat dissipation bottom plate is connected to the air inlet, and the right side of the front end of the heat dissipation bottom plate is connected to the air outlet.

The layout of UAV motor and electric regulator is often compact. If thermal conductive silicone film is used, it is inconvenient for operators to take, place and install it because of its small size. Thermal conductive gel is better than thermal conductive silicone film in practical operation. The thermal conductive gel realizes the automatic dispensing operation of the equipment, which is more suitable for the operation of today's high-tech production lines.

Thermal conductive gelMainly used for heat dissipation between the image transmission motherboard and the heat dissipation board; The heat conduction gel, the heat dissipation tube and the heat outlet are used together. When in use, the heat dissipation tube can effectively absorb the heat inside the UAV, and quickly dissipate the heat on the heat dissipation tube through the heat outlet, solving the problem of poor heat dissipation effect.

Thermal conductive gel is not as well known as thermal conductive silicon film in the heat dissipation application of UAVs and other electronic products, but thermal conductive gel plays a very important role in UAV technology iteration.

Radiate heat into the air and conduct it to the ground layer of the motherboard for heat dissipation through a shielding cover.

9、 Intelligent projector products

In recent years, projectors have been widely used in offices, entertainment venues, homes, schools, and other places. In order to better optimize user experience, projector products are constantly evolving. However, while improving functionality, it is necessary to effectively dissipate heat, maintain stable temperature, and ensure work efficiency.

According to the imaging principle of projectors, extremely high brightness is required when projecting input signals. To ensure such high brightness output, projectors must use high-power light sources. After a long period of work, a high amount of heat is inevitably generated inside the machine. In addition to the heat generated by the projector light source, the projector's power supply also generates a significant amount of heat during operation. The heat generated by projector bulbs, imaging systems, power supplies, and other components is concentrated in the narrow space inside the machine. The high temperature generated not only affects the normal use of the projector, but also greatly shortens the service life of internal components.

The heat dissipation structure of the projector includes a heat pipe, multiple fins arranged on the heat pipe, and a fan arranged on one side of the multiple fins. One end of the heat pipe is fixedly connected to the light source side of the projector body, and the other end is set away from the projector body. Multiple fins are fixed at the end of the heat pipe away from the projector body. The fan is electrically connected to the projector body to drive air flow and reduce the temperature of the fins. The heat generated by the operation of the projector body can be transmitted to the fins through heat pipes, and then the temperature of the fins can be reduced by driving the flow of air through a fan. In this way, the heat dissipation of the projector is accelerated, while also avoiding the problem of high-temperature air staying near the projector body and affecting its normal operation.

If a projector is used in an area with high temperatures all year round, relying solely on a fan for heat dissipation is not enough. Therefore, many companies have modified the fan installed inside the projector, including the heat dissipation method, heat dissipation materials, etc., to fundamentally solve the problem of the projector not being able to work continuously.

Thermal conductive silicone gasketSoft, thermally conductive and insulated, especially with good compressibility and thickness that can adapt to different spatial ranges of smart projectors, it has good controllability. The thermal conductive silicone sheet is well filled between the heat transfer tube fins and the cooling fan of the projector, achieving seamless connection between the heat source and the cooling fan, reducing the thermal resistance of the contact surface between the internal heating element and the cooling fan of the projector, perfectly and effectively transferring heat, maintaining a stable temperature of the projector, and ensuring its working efficiency.

10、 Network switch products

With the rapid development of technology, our society has entered the information age. In this society, the internet has become an indispensable part of people's lives. With the rapid development of the information age and the gradual popularization of cloud services, the data storage capacity of various industries has increased rapidly due to the popularity of cloud services. The large-scale expansion of servers has also brought about more demand for switches. I believe everyone knows about routers, but most people generally don't know what a network switch is. What can it do for our network?

Network switches are important components that connect servers and network devices, and build data centers. Due to the popularization of cloud services, the high-density of network devices and the surge in the number of connected devices have increased the load on switches. The new type of switch faces the challenge of balancing performance improvement and power consumption reduction.

The industrial switch integrates MAC switching module, PHY interface chip, main control chip, memory and other devices. Due to the fatal impact of high temperatures on industrial grade switches, when designing such products, in addition to selecting industrial grade components with a wide temperature range, it is also important to pay full attention to the thermal design of the equipment.

In order to meet the reliability application requirements, most industrial grade switches adopt fanless cooling design for the entire machine. For chips with high heat generationThermal conductive silicone gasket, thermal conductive phase change materialThe material is used to fill the gap between the contact surfaces, forming a thermal conduction channel from the chip surface to the housing, thereby ensuring that the chip operates within a safe temperature range and that the switch operates reliably and safely in high-temperature environments.

The heat dissipation structure of a switch includes a switch housing and a circuit board: an upper thermal pad is provided on top of the circuit board, a metal heat sink is provided on top of the thermal pad, and a thermal pad is provided below the circuit board, which is in contact with the inner surface of the switch housing; Thermal pads are elastic objects that can effectively ensure a tight fit between the thermal pads and the inner surface of the switch housing; Part of the heat generated by the circuit board is transferred to the metal heat sink through the upper thermal pad and then diffused into the interior of the switch, and then diffused into the air through the switch housing. Another part of the heat is transferred to the switch housing through the lower thermal pad and then diffused into the air; This solution is particularly suitable for small switches, which can effectively avoid problems such as volume increase, cost increase, and easy damage caused by installing cooling fans.

Thermal conductive silicone gaskets are mainly used for thermal conduction and heat dissipation between motherboards and casings. The main purpose of using thermal conductive silicone gaskets is to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat sink component. Thermal conductive silicone gaskets can effectively fill the gaps between the contact surfaces; With the addition of thermal conductive silicon film, the contact surface between the heat source and the heat sink can be better and fully contacted, truly achieving face-to-face contact, and the temperature reaction can achieve the smallest possible temperature difference; Thermal conductive silicone sheets not only have insulation properties, but also have shock-absorbing and sound-absorbing effects.

11、 Computer server products

People often use network technology in their daily work and life. It can be said that today's society cannot do without communication networks. In ancient times, communication between the south and the north could only be done through letters. If the distance was far away, it may take several months to reach. However, now people are interconnected through the internet, ignoring distance and time. As a node of the network, the computer server that stores and processes 80% of the data on the network needs to work 24 hours a day without interruption.

The composition of computer servers is similar to that of microcomputers, including processors, hard drives, memory, system buses, etc. They are specially designed for specific network applications, so there are significant differences between computer servers and microcomputers in terms of processing power, stability, reliability, security, scalability, and manageability.

A computer server is a high-performance computer, and network terminal devices such as microcomputers in homes and businesses must also go through the computer server to access the internet, obtain information, communicate with the outside world, entertain, etc. Therefore, it can also be said that the computer server is responsible for "organizing" and "leading" these devices. A long-lasting and efficient computer server is a must-have for an enterprise.

There are many factors that affect computer servers, and heat dissipation is one of the main factors. Computer servers are high-performance computers and also machines with extremely high power consumption, which emit a lot of heat. Some large enterprises will set up a dedicated air conditioning room for computer servers.

The heating of computer server equipment is a widespread phenomenon in daily life, mainly due to the inability to fully convert electrical energy into target energy. Most of the energy is lost in the form of heat, resulting in the heating of machine equipment during operation. Air is a poor conductor of heat, and the efficiency of heat transfer through air decreases, leading to poor heat dissipation.

Thermal conductive materials are materials designed to solve the problem of low heat transfer efficiency, and there are many types of thermal conductive materials, such asThermal conductive silicone sheet, thermal conductive silicone grease, thermal conductive gel, thermal conductive double-sided adhesive, thermal conductive adhesive, thermal conductive silicone tapeWait, every thermal conductive material has its own characteristics and areas of expertise. Although they have various differences, their purpose is to improve heat transfer efficiency.

In the internal structure of computer servers, there are gaps between the heat source and the heat sink. Even if there are two seemingly smooth and flat surfaces, there are still some pits, and there are gaps when they are attached. There is a large amount of air in the gaps, so the efficiency of heat transfer will be reduced. Thermal conductive materials fill the gaps between the two, filling all the large and small pits to reduce the contact thermal resistance, so that the heat source and heat sink can be in close contact, thereby improving the heat dissipation effect and ensuring the long-term stable operation of the machine equipment.