A ultra-fine silver coated copper powder for electronic packaging conductive adhesive

Another important component of modern electronics industry is electronic packaging technology, and in today's packaging technology, the connection technology between circuits and chips, substrates and chips restricts the portability and miniaturization of electronic products. Due to the low resolution, large volume, and lack of environmental friendliness of Pb/Sn solder joints, they no longer meet the requirements of connecting materials. Looking for solder joints with higher resolution, lower cost, good environmental performance, and good conductivityConductive adhesive materialReplacing alloy solder is currently the focus of exploration in connection technology.

Conductive adhesive material is a special adhesive with conductivity comparable to that of metal materials, which connects various types of materials by adding conductive fillers, curing agents, or other additivesElectronic packaging conductive adhesiveAfter curing the organic polymer matrix, conductive pathways are formed between the interconnected materials, resulting in good electrical conductivity.

Metal powders with low resistivity such as Au, Ag, Cu, Ni, etc. are currently commonly used conductive fillers. Among them, Au powder is the best so farconductive fillerBut the expensive price restricts its use; Ag will undergo silver ion migration under the action of an electric field, reducing its conductivity and shortening the material's lifespan; Ni and Cu have low cost and do not undergo ion migration, but their surfaces are easily oxidized at high temperatures, resulting in increased electrical resistivity and affecting material properties. With the development and progress of technology, using silver coated copper powder as raw material, selecting electron donating chelating agents such as amine compounds to chelate the exposed copper on the surface of silver coated copper powder, and adding electron acceptor complexes to jointly form electron transfer complexes to prepare conductive adhesives with high moisture resistance and conductivity is the trend of development.

Micro scale silver coated copper powder, as a composite conductive functional phase of electronic paste, overcomes the application problem of high surface activity and easy oxidation of ultrafine copper powder, fully utilizes the high conductivity and oxidation resistance of silver, as well as the advantages of low cost and good conductivity of copper powder, and has extremely high cost-effectiveness. Therefore, silver coated copper powder can partially replace copper powder and silver powder in applications such as conductive fillers, rubber, electromagnetic shielding, chemical catalysts, conductive slurries, powder metallurgy, etc.
Silver coated copper powder, as a highly conductive filler, can be added to coatings (paints), adhesives (binders), inks, polymer slurries, plastics, rubber, and other materials to produce various conductive and electromagnetic shielding products. It is widely used in various industrial sectors such as electronics, electromechanical, communication, printing, aerospace, weapons, etc. Conductive and electromagnetic shielding of electronic, electrical, and communication products such as computers, mobile phones, electronic medical equipment, and electronic instruments.