The heat conduction series of Advanced Institute Science and Technology is a soft product with pre formed low hardness. The heat conduction gel inherits the advantages of silica gel material, such as good affinity, weather resistance, high and low temperature resistance, and good insulation. At the same time, it has strong plasticity, can meet the filling of uneven interfaces, and can meet the heat transfer requirements in various applications. The product requires low stress and high modulus of elasticity during use, which can achieve automated production; Has good contact with electronic products during assembly, exhibiting low contact thermal resistance and good electrical insulation properties. The cured thermal conductive adhesive is equivalent to a thermal pad, with good high temperature resistance and aging resistance, and can work for a long time at -40~200 ℃.
characteristic:
1. Thermal conductivity coefficient of 1.2~9.0W/m.K
2. Low viscosity, easy to apply glue, and low compression force application
3. Adjustable curing time, excellent high and low temperature mechanical and chemical stability
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